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CIC21P221NE

P1-P3
Ver.
201306
FEATURES
APPLICATION
DIMENSION
Type
Dimension
[
mm]
L W t d
21 2.0±0.2 1.25±0.2 0.9±0.2
0.5+0.2
-0.3
DESCRIPTION
Chip
ChipChip
Chip Bead
BeadBead
Bead
For
ForFor
For High
HighHigh
High Current
CurrentCurrent
Current
RECOMMENDED LAND PATTERN
CIC21 Series
(2012/
EIA
0805)
Part no.
Thickness
(
mm)
Impedance
(Ω)±25%@100
MHz
DC Resistance
(Ω)
Max.
Rated Current
(
mA) Max.
CIC21P110
0.90±0.2 11 0.05 6000
CIC21P300
0.90±0.2 30 0.015 3000
CIC21P600
0.90±0.2 60 0.025 3000
CIC21P800
0.90±0.2 80 0.025 2500
CIC21P101
0.90±0.2 100 0.02 2000
CIC21P121
0.90±0.2 120 0.05 2000
CIC21P221
0.90±0.2 220 0.035 3200
CIC21P331
0.85±0.2 330 0.05 2000
CIC21P601
0.90±0.2 600 0.15 1000
CIC21J600
0.90±0.2 60 0.03 3800
CIC21J121
0.90±0.2 120 0.05 2500
CIC21J221
0.90±0.2 220 0.05 1500
CIC21J301
0.90±0.2 300 0.10 1500
CIC21J471
0.90±0.2 470 0.08 1500
CIC21J601
0.90±0.2 600 0.15 1000
N
oise Suppression in power line
CIC series is used for high current.
)
0.6~1.2
mm
0.6~1.2
mm
0.8~1.2
mm
0.9~1.6
mm
Ver.
201306
CHARACTERISTIC DATA
Ver.
201306
CI
C 21 P 110 N E
(1) (2) (3) (4) (5) (6) (7)
(1)
Chip Beads
(2)
For High current(C:~3A)
(3)
Dimension
(4)
Material Code
(5)
Nominal impedance
(110:11Ω, 221:220Ω )
(6)
Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(7)
Packaging(C:paper tape, E:embossed tape)
PACKAGING
Packaging Style Quantity(pcs/reel)
Embossed Taping
4000
RECOMMENDED SOLDERING CONDITION
PRODUCT IDENTIFICATION
REFLOW SOLDERING
FLOW SOLDERING
Any data in this sheet are subject to change, modify or discontinue without notice.
The data sheets include the typical data for design reference only. If there is any question regarding the
data sheets, please contact our sales personnel or application engineers.
P1-P3

CIC21P221NE

Mfr. #:
Buy CIC21P221NE
Manufacturer:
Description:
Ind Chip Bead 220Ohm 25% 100MHz Ferrite 3.2A 0805 Embossed T/R (Alt: CIC21P221NE)
Lifecycle:
New from this manufacturer.
Delivery:
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