SI2303CDS-T1-GE3

Vishay Siliconix
Si2303CDS
Document Number: 69991
S-83053-Rev. B, 29-Dec-08
www.vishay.com
1
P-Channel 30-V (D-S) MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Available
TrenchFET
®
Power MOSFET
100 % R
g
Tested
100 % UIS Tested
APPLICATIONS
Load Switch
Notes:
a. Based on T
C
= 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. Maximum under Steady State conditions is 160 °C/W.
MOSFET PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)
I
D
(A)
a
Q
g
(Typ.)
- 30
0.190 at V
GS
= - 10 V
- 2.7
2 nC
0.330 at V
GS
= - 4.5 V
- 2.1
G
TO-236
(SOT-23)
S
D
Top View
2
3
1
Si2303CDS (N3)*
* Marking Code
Ordering Information: Si2303CDS-T1-E3 (Lead (Pb)-free)
Si2303CDS-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
- 30
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
- 2.7
A
T
C
= 70 °C
- 2.2
T
A
= 25 °C
- 1.9
b, c
T
A
= 70 °C
- 1.5
b, c
Pulsed Drain Current
I
DM
- 10
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
- 1.75
T
A
= 25 °C
- 0.83
b, c
Avalanche Current
L = 0.1 mH
I
AS
- 5
Single Pulse Avalanche Energy
E
AS
1.25
mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
2.3
W
T
C
= 70 °C
1.5
T
A
= 25 °C
1.0
b, c
T
A
= 70 °C
0.7
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
°C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, d
5 s
R
thJA
80 120
°C/W
Maximum Junction-to-Foot (Drain)
Steady State
R
thJF
35 55
www.vishay.com
2
Document Number: 69991
S-83053-Rev. B, 29-Dec-08
Vishay Siliconix
Si2303CDS
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
MOSFET SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
DS
= 0 V, I
D
= - 250 µA
- 30 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= - 250 µA
- 27
mV/°C
V
GS(th)
Temperature Coefficient
Δ
V
GS(th)
/T
J
3.8
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= - 250 µA
- 1 - 3 V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= - 30 V, V
GS
= 0 V
- 1
µA
V
DS
= - 30 V, V
GS
= 0 V, T
J
= 55 °C
- 10
On-State Drain Current
a
I
D(on)
V
DS
- 5 V, V
GS
= - 10 V
- 10 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= - 10 V, I
D
= - 1.9 A
0.158 0.190
Ω
V
GS
= - 4.5 V, I
D
= - 1.4 A
0.275 0.330
Forward Transconductance
a
g
fs
V
DS
= - 5 V, I
D
= - 1.9 A
2S
Dynamic
b
Input Capacitance
C
iss
V
DS
= - 15 V, V
GS
= 0 V, f = 1 MHz
155
pFOutput Capacitance
C
oss
35
Reverse Transfer Capacitance
C
rss
25
Total Gate Charge
Q
g
V
DS
= - 15 V, V
GS
= - 10 V, I
D
= - 1.9 A
48
nC
V
DS
= - 15 V, V
GS
= - 4.5 V, I
D
= - 1.9 A
24
Gate-Source Charge
Q
gs
0.6
Gate-Drain Charge
Q
gd
1
Gate Resistance
R
g
f = 1 MHz 1.7 8.5 17 Ω
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 15 V, R
L
= 10 Ω
I
D
= - 1.5 A, V
GEN
= - 10 V, R
G
= 1 Ω
48
ns
Rise Time
t
r
11 18
Turn-Off Delay Time
t
d(off)
11 18
Fall Time
t
f
816
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 15 V, R
L
= 10 Ω
I
D
- 1.5 A, V
GEN
= - 4.5 V, R
G
= 1 Ω
36 44
Rise Time
t
r
37 45
Turn-Off Delay Time
t
d(off)
12 18
Fall Time
t
f
914
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
- 1.75
A
Pulse Diode Forward Current
a
I
SM
- 10
Body Diode Voltage
V
SD
I
S
= - 1.5 A
- 0.8 - 1.2 V
Body Diode Reverse Recovery Time
t
rr
I
F
= - 1.5 A, di/dt = 100 A/µs, T
J
= 25 °C
17 26 ns
Body Diode Reverse Recovery Charge
Q
rr
914nC
Reverse Recovery Fall Time
t
a
12
ns
Reverse Recovery Rise Time
t
b
5
Document Number: 69991
S-83053-Rev. B, 29-Dec-08
www.vishay.com
3
Vishay Siliconix
Si2303CDS
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
On-Resistance vs. Drain Current and Gate Voltage
Gate Charge
0
2
4
6
8
10
012345
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
V
GS
=10thru 5 V
V
GS
=3V
V
GS
=4V
0
0.1
0.2
0.3
0.4
0.5
02468 10
- On-Resistance (Ω)R
DS(on)
I
D
- Drain Current (A)
V
GS
= 10 V
V
GS
=4.5V
I
D
=1.9A
0
2
4
6
8
10
01234
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
V
DS
=24V
V
DS
=15V
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0.0
0.2
0.4
0.6
0.8
1.0
01234
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
T
C
= 25 °C
T
C
= 125 °C
T
C
= - 55 °C
C
rss
0
60
120
180
240
300
0 6 12 18 24 30
C
iss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
C
oss
0.6
0.8
1.0
1.2
1.4
1.6
- 50 - 25 0 25 50 75 100 125 150
T
J
-Junction Temperature (°C)
(Normalized)
- On-Resistance
R
DS(on)
V
GS
=10V,I
D
=1.9A
V
GS
=4.5V,I
D
=1.4A

SI2303CDS-T1-GE3

Mfr. #:
Manufacturer:
Vishay
Description:
MOSFET P-CH 30V 2.7A SOT23-3
Lifecycle:
New from this manufacturer.
Delivery:
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