7
Remote/Local Temperature Sensor
with SMBus Serial Interface
MAX1617
Maxim Integrated
Figure 1. Functional Diagram
REMOTE
MUX
LOCAL
REMOTE TEMPERATURE
DATA REGISTER
HIGH-TEMPERATURE THRESHOLD
(REMOTE T
HIGH
)
LOW-TEMPERATURE THRESHOLD
(REMOTE T
LOW
)
DIGITAL COMPARATOR
(REMOTE)
LOCAL TEMPERATURE
DATA REGISTER
HIGH-TEMPERATURE THRESHOLD
(LOCAL T
HIGH)
LOW-TEMPERATURE THRESHOLD
(LOCAL T
LOW
)
DIGITAL COMPARATOR
(LOCAL)
COMMAND BYTE
(INDEX) REGISTER
SMBDATA
SMBCLK
ADDRESS
DECODER
READ WRITE
CONTROL
LOGIC
SMBUS
ADD1ADD0STBY
STATUS BYTE REGISTER
CONFIGURATION
BYTE REGISTER
CONVERSION RATE
REGISTER
ALERT RESPONSE
ADDRESS REGISTER
SELECTED VIA
SLAVE ADD = 0001 100
ADC
+
DIODE
FAULT
DXP
DXN
GND
V
CC
-
+
-
+
-
8
8
8
8
8
8
88
2
7
ALERT
QS
R
MAX1617
8
Remote/Local Temperature Sensor
with SMBus Serial Interface
MAX1617
Maxim Integrated
A/D Conversion Sequence
If a Start command is written (or generated automatical-
ly in the free-running auto-convert mode), both channels
are converted, and the results of both measurements
are available after the end of conversion. A BUSY status
bit in the status byte shows that the device is actually
performing a new conversion; however, even if the ADC
is busy, the results of the previous conversion are
always available.
Remote-Diode Selection
Temperature accuracy depends on having a good-qual-
ity, diode-connected small-signal transistor. See Table 1
for a recommended list of diode-connected small-signal
transistors. The MAX1617 can also directly measure the
die temperature of CPUs and other integrated circuits
having on-board temperature-sensing diodes.
The transistor must be a small-signal type with a rela-
tively high forward voltage; otherwise, the A/D input
voltage range can be violated. The forward voltage
must be greater than 0.25V at 10µA; check to ensure
this is true at the highest expected temperature. The
forward voltage (V
DXP
- V
DXN
) must be less than 0.95V
at 100µA; additionally, ensure the maximum V
DXP
(DXP
voltage) (0.78 x V
CC
- 1.1) volts over your expected
range of temperature. Large power transistors don’t
work at all. Also, ensure that the base resistance is less
than 100. Tight specifications for forward-current gain
(+50 to +150, for example) indicate that the manufac-
turer has good process controls and that the devices
have consistent VBE characteristics.
For heat-sink mounting, the 500-32BT02-000 thermal
sensor from Fenwal Electronics is a good choice. This
device consists of a diode-connected transistor, an
aluminum plate with screw hole, and twisted-pair cable
(Fenwal Inc., Milford, MA, 508-478-6000).
Thermal Mass and Self-Heating
Thermal mass can seriously degrade the MAX1617’s
effective accuracy. The thermal time constant of the
QSOP-16 package is about 140sec in still air. For the
MAX1617 junction temperature to settle to within +1°C
after a sudden +100°C change requires about five time
constants or 12 minutes. The use of smaller packages
for remote sensors, such as SOT23s, improves the situ-
ation. Take care to account for thermal gradients
between the heat source and the sensor, and ensure
that stray air currents across the sensor package do
not interfere with measurement accuracy.
Self-heating does not significantly affect measurement
accuracy. Remote-sensor self-heating due to the diode
current source is negligible. For the local diode, the
worst-case error occurs when auto-converting at the
fastest rate and simultaneously sinking maximum cur-
rent at the ALERT output. For example, at an 8Hz rate
and with ALERT sinking 1mA, the typical power dissi-
pation is V
CC
x 450µA plus 0.4V x 1mA. Package theta
J-A is about 150°C/W, so with V
CC
= 5V and no copper
PCB heat-sinking, the resulting temperature rise is:
dT = 2.7mW x 150°C/W = 0.4°C
Even with these contrived circumstances, it is difficult
to introduce significant self-heating errors.
ADC Noise Filtering
The ADC is an integrating type with inherently good
noise rejection, especially of low-frequency signals such
as 60Hz/120Hz power-supply hum. Micropower opera-
tion places constraints on high-frequency noise rejec-
tion; therefore, careful PCB layout and proper external
noise filtering are required for high-accuracy remote
measurements in electrically noisy environments.
High-frequency EMI is best filtered at DXP and DXN
with an external 2200pF capacitor. This value can be
increased to about 3300pF (max), including cable
capacitance. Higher capacitance than 3300pF intro-
duces errors due to the rise time of the switched cur-
rent source.
Nearly all noise sources tested cause the ADC measure-
ments to be higher than the actual temperature, typically
by +1°C to +10°C, depending on the frequency and
amplitude (see Typical Operating Characteristics).
CMPT3904Central Semiconductor (USA)
MMBT3904Motorola (USA)
MMBT3904
SST3904Rohm Semiconductor (Japan)
KST3904-TFSamsung (Korea)
FMMT3904CT-NDZetex (England)
MANUFACTURER MODEL NUMBER
SMBT3904Siemens (Germany)
Table 1. Remote-Sensor Transistor
Manufacturers
Note: Transistors must be diode-connected (base shorted to
collector).
National Semiconductor (USA)
9
Remote/Local Temperature Sensor
with SMBus Serial Interface
MAX1617
Maxim Integrated
PCB Layout
1) Place the MAX1617 as close as practical to the
remote diode. In a noisy environment, such as a
computer motherboard, this distance can be 4 in. to
8 in. (typical) or more as long as the worst noise
sources (such as CRTs, clock generators, memory
buses, and ISA/PCI buses) are avoided.
2) Do not route the DXP–DXN lines next to the deflec-
tion coils of a CRT. Also, do not route the traces
across a fast memory bus, which can easily intro-
duce +30°C error, even with good filtering.
Otherwise, most noise sources are fairly benign.
3) Route the DXP and DXN traces in parallel and in
close proximity to each other, away from any high-
voltage traces such as +12V
DC
. Leakage currents
from PCB contamination must be dealt with careful-
ly, since a 20M leakage path from DXP to ground
causes about +1°C error.
4) Connect guard traces to GND on either side of the
DXP–DXN traces (Figure 2). With guard traces in
place, routing near high-voltage traces is no longer
an issue.
5) Route through as few vias and crossunders as possi-
ble to minimize copper/solder thermocouple effects.
6) When introducing a thermocouple, make sure that
both the DXP and the DXN paths have matching
thermocouples. In general, PCB-induced thermo-
couples are not a serious problem. A copper-solder
thermocouple exhibits 3µV/°C, and it takes about
200µV of voltage error at DXP–DXN to cause a
+1°C measurement error. So, most parasitic ther-
mocouple errors are swamped out.
7) Use wide traces. Narrow ones are more inductive
and tend to pick up radiated noise. The 10 mil
widths and spacings recommended in Figure 2
aren’t absolutely necessary (as they offer only a
minor improvement in leakage and noise), but try to
use them where practical.
8) Keep in mind that copper can’t be used as an EMI
shield, and only ferrous materials such as steel work
well. Placing a copper ground plane between the
DXP-DXN traces and traces carrying high-frequency
noise signals does not help reduce EMI.
PCB Layout Checklist
Place the MAX1617 close to a remote diode.
Keep traces away from high voltages (+12V bus).
Keep traces away from fast data buses and CRTs.
Use recommended trace widths and spacings.
Place a ground plane under the traces.
Use guard traces flanking DXP and DXN and con-
necting to GND.
Place the noise filter and the 0.1µF V
CC
bypass
capacitors close to the MAX1617.
Add a 200 resistor in series with VCC for best
noise filtering (see Typical Operating Circuit).
Twisted Pair and Shielded Cables
For remote-sensor distances longer than 8 in., or in par-
ticularly noisy environments, a twisted pair is recom-
mended. Its practical length is 6 feet to 12 feet (typical)
before noise becomes a problem, as tested in a noisy
electronics laboratory. For longer distances, the best
solution is a shielded twisted pair like that used for audio
microphones. For example, Belden #8451 works well for
distances up to 100 feet in a noisy environment. Connect
the twisted pair to DXP and DXN and the shield to GND,
and leave the shield’s remote end unterminated.
Excess capacitance at DX_ limits practical remote sen-
sor distances (see Typical Operating Characteristics).
For very long cable runs, the cable’s parasitic capaci-
tance often provides noise filtering, so the 2200pF
capacitor can often be removed or reduced in value.
Cable resistance also affects remote-sensor accuracy;
1 series resistance introduces about +1/2°C error.
Low-Power Standby Mode
Standby mode disables the ADC and reduces the sup-
ply-current drain to less than 10µA. Enter standby
mode by forcing the STBY pin low or via the RUN/STOP
bit in the configuration byte register. Hardware and
software standby modes behave almost identically: all
data is retained in memory, and the SMB interface is
alive and listening for reads and writes. The only differ-
ence is that in hardware standby mode, the one-shot
command does not initiate a conversion.
Standby mode is not a shutdown mode. With activity on
the SMBus, extra supply current is drawn (see Typical
Operating Characteristics). In software standby mode,
MINIMUM
10MILS
Figure 2. Recommended DXP/DXN PC Traces

MAX1617AMEE

Mfr. #:
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SENSOR DIGITAL -55C-125C 16QSOP
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