TLP2108(TP,F)

TLP2108
2014-09-01
4
Switching Characteristics
(Unless otherwise specified, Ta=-40 to 100℃、V
CC
=4.5 to 20 V)(Each Channel)
CHARACTERISTIC SYMBOL
TEST
CIRCUIT
TEST CONDITION MIN TYP. MAX UNIT
Propagation Delay Time
to Logic High output
t
pLH
7, 8
I
F
=30 mA 30 150 250 ns
Propagation Delay Time
to Logic Low output
t
pHL
I
F
=03 mA 30 150 250 ns
Switching Time Dispersion
between ON and OFF
|t
pHL
t
pLH
|
220 ns
Rise Time (10 – 90 %) t
I
F
=30 mA, V
CC
=5 V 30 75 ns
Fall Time (90 – 10 %) t
f
I
F
=03 mA, V
CC
=5 V 30 75 ns
Common Mode transient
Immunity at High Level Output
CM
H
9
V
CM
=1000 V
p-p
, I
F
=0 mA,
V
CC
=20 V, Ta=25°C
10000
V/μs
Common Mode transient
Immunity at Low Level Output
CM
L
V
CM
=1000 V
p-p
, I
F
=5 mA,
V
CC
=20 V, Ta=25°C
-10000 V/μs
*All typical values are at Ta=25°C
Note 5: A ceramic capacitor (0.1 μA) should be connected from pin 8 to pin 5 to stabilize the operation of the high
gain linear amplifier. Failure to provide the bypassing may impair the switching property. The total lead length
between capacitor and coupler should not exceed 1 cm.
TEST CIRCUIT 1: V
OL
Test Circuit TEST CIRCUIT 2: V
OH
Test Circuit
TEST CIRCUIT 3: I
CCL
Test Circuit TEST CIRCUIT 4: I
CCH
Test Circuit
TEST CIRCUIT 5: I
OSL
Test Circuit TEST CIRCUIT 6: I
OSH
Test Circuit
V
CC
I
F
V
CC
GND
SHIELD
1
3
4
2
6
7
8
5
V
0.1 μF
V
OL
I
O
1
3
4
2
V
CC
GND
SHIELD
6
7
8
5
V
V
CC
0.1 μF
V
O
I
O
V
F
1
3
6
7
8
V
CC
GND
SHIELD
5 4
2
A
I
F1
I
F2
V
CC
0.1 μF
I
CCL
1
3 6
7
8
V
CC
GND
SHIELD
5
4
2
A
V
CC
0.1 μF
I
CCH
V
CC
GND
SHIELD
1
3
4
2
6
7
8
5
A
I
F
V
CC
0.1 μF
V
O
I
OSL
1
3
4
2
V
CC
GND
SHIELD
6
7
8
5
A
V
CC
0.1 μF
V
O
I
OSH
TLP2108
2014-09-01
5
TEST CIRCUIT 7: Switching Time Test Circuit
TEST CIRCUIT 8: Switching Time Test Circuit
TEST CIRCUIT 9: Common-Mode Transient Immunity Test Circuit
V
OH
V
OL
t
pLH
t
pHL
1.3 V
50%
t
f
t
r
90%
10%
I
F
1
3
6
7
8
V
CC
GND
IELD
5
4
2
SW
B
V
CC
V
CM
V
O
0.1 μF
I
F
A
P.G.: Pulse generator
C
L
includes probe and stray capacitance.
0.1 μF
I
F
monitor
C
L
=15 pF
C
L
1
3 6
7
8
V
CC
GND
SHIELD
5
4
2
V
CC
V
O
R
IN
=100 Ω
I
F
=3 mA(P.G)
(f=50 kHz , duty=50%)
V
OH
V
OL
t
pLH
t
pHL
1.3 V
50%
t
f
t
r
90%
10%
I
F
)(
)(800
s
t
f
V
H
CM
μ
=
)(
)(800
s
t
r
V
L
CM
μ
=
V
CM
10%
90%
1000 V
SW B : I
F
=0 mA
SW A : I
F
=5 mA
1 V
17V
V
O
t
r
t
f
CM
L
CM
H
I
F
=3 mA(P.G)
(f=50 kHz , duty=50%)
I
F
monito
r
P.G.: Pulse generator
C
L
includes probe and stray capacitance.
620Ω
0.1 μF
R
IN
=100 Ω
C
L
=15 pF
C
L
1
3
6
7
8
V
CC
GND
SHIELD
5
4
2
5
5V
V
CC
V
O
TLP2108
2014-09-01
6
Specification for Embossed–Tape Packing (TP) for SO8 Coupler
1. Applicable Package
Package Product Type
SO8 Photocoupler
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
(Example)
3. Tape Dimensions
3.1 Orientation of Device in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Figure 1 Device Orientation
3.2 Tape Packing Quantity: 2500 devices per reel
3.3 Empty Device Recesses are as Shown in Table 1.
Table 1 Empty Device Recesses
Standard Remarks
Occurrences of 2 or more
successive empty device
recesses
0
Within any given 40-mm section of
tape, not including leader and trailer
Single empty device
recesses
6 devices (max) per reel Not including leader and trailer
3.4 Start and End of Tape
The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty turns
only for a cover tape.
TLP2108 (TP)
Device name
Tape type

TLP2108(TP,F)

Mfr. #:
Manufacturer:
Toshiba
Description:
High Speed Optocouplers Photocoupler, Photo IC Output
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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