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MC74LCX125DR2G

P1-P3P4-P6P7-P7
MC74LCX125
http://onsemi.com
4
AC CHARACTERISTICS (t
R
= t
F
= 2.5 ns; R
L
= 500 W)
Symbol
Parameter Waveform
Limits
Units
T
A
= −40C to +85C
V
CC
= 3.3 V 0.3 V V
CC
= 2.7 V V
CC
= 2.5 V 0.2 V
C
L
= 50 pF
C
L
= 50 pF C
L
= 30 pF
Min Max Min Max Min Max
t
PLH
t
PHL
Propagation Delay Time
Input to Output
1 1.5
1.5
6.0
6.0
1.5
1.5
6.5
6.5
1.5
1.5
7.2
7.2
ns
t
PZH
t
PZL
Output Enable Time to
High and Low Level
2 1.5
1.5
7.0
7.0
1.5
1.5
8.0
8.0
1.5
1.5
9.1
9.1
ns
t
PHZ
t
PLZ
Output Disable Time From
High and Low Level
2 1.5
1.5
6.0
6.0
1.5
1.5
7.0
7.0
1.5
1.5
7.2
7.2
ns
t
OSHL
t
OSLH
Output−to−Output Skew
(Note 3)
1.0
1.0
ns
3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (t
OSHL
) or LOW−to−HIGH (t
OSLH
); parameter
guaranteed by design.
DYNAMIC SWITCHING CHARACTERISTICS
T
A
= +25C
Symbol Characteristic Condition Min Typ Max Units
V
OLP
Dynamic LOW Peak Voltage
(Note 4)
V
CC
= 3.3 V, C
L
= 50 pF, V
IH
= 3.3 V, V
IL
= 0 V
V
CC
= 2.5 V, C
L
= 30 pF, V
IH
= 2.5 V, V
IL
= 0 V
0.8
0.6
V
V
OLV
Dynamic LOW Valley Voltage
(Note 4)
V
CC
= 3.3 V, C
L
= 50 pF, V
IH
= 3.3 V, V
IL
= 0 V
V
CC
= 2.5 V, C
L
= 30 pF, V
IH
= 2.5 V, V
IL
= 0 V
−0.8
−0.6
V
4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is
measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Units
C
IN
Input Capacitance V
CC
= 3.3 V, V
I
= 0 V or V
CC
7 pF
C
OUT
Output Capacitance V
CC
= 3.3 V, V
I
= 0 V or V
CC
8 pF
C
PD
Power Dissipation Capacitance 10 MHz, V
CC
= 3.3 V, V
I
= 0 V or V
CC
25 pF
ORDERING INFORMATION
Device Package Shipping
†
MC74LCX125DG SOIC−14
(Pb−Free)
55 Units / Rail
MC74LCX125DR2G SOIC−14
(Pb−Free)
2500 Tape & Reel
MC74LCX125DTG TSSOP−14
(Pb−Free)
96 Units / Rail
MC74LCX125DTR2G TSSOP−14
(Pb−Free)
2500 Tape & Reel
NLVLCX125DTR2G TSSOP−14*
(Pb−Free)
2500 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified.
MC74LCX125
http://onsemi.com
5
WAVEFORM 1 − PROPAGATION DELAYS
t
R
= t
F
= 2.5 ns, 10% to 90%; f = 1 MHz; t
W
= 500 ns
V
CC
0 V
V
OH
V
OL
Dn
On
t
PHL
t
PLH
WAVEFORM 2 − OUTPUT ENABLE AND DISABLE TIMES
t
R
= t
F
= 2.5 ns, 10% to 90%; f = 1 MHz; t
W
= 500 ns
V
CC
0 V
0 V
OE
n
On
t
PZH
3.0 V
t
PHZ
t
PZL
t
PLZ
On
VmiVmi
Vmo Vmo
Figure 3. AC Waveforms
V
CC
V
OH
− 0.3 V
V
OL
+ 0.3 V
GND
Symbol
V
CC
3.3 V 0.3 V 2.7 V 2.5 V 0.2 V
Vmi 1.5 V 1.5 V V
CC
/2
Vmo 1.5 V 1.5 V V
CC
/2
VmiVmi
Vmo
Vmo
PULSE
GENERATOR
R
T
DUT
V
CC
R
L
C
L
C
L
= 50 pF at V
CC
= 3.3 0.3 V or equivalent (includes jig and probe capacitance)
C
L
= 30 pF at V
CC
= 2.5 0.2 V or equivalent (includes jig and probe capacitance)
R
L
= R
1
= 500 W or equivalent
R
T
= Z
OUT
of pulse generator (typically 50 W)
Figure 4. Test Circuit
MC74LCX125
http://onsemi.com
6
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G
ISSUE B
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.50 0.60 0.020 0.024
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V
S
T
L
−U−
SEATING
PLANE
0.10 (0.004)
−T−
SECTION N−N
DETAIL E
J
J1
K
K1
DETAIL E
F
M
−W−
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
−V−
14X REFK
N
N
7.06
14X
0.36
14X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
P1-P3P4-P6P7-P7

MC74LCX125DR2G

Mfr. #:
Buy MC74LCX125DR2G
Manufacturer:
ON Semiconductor
Description:
Buffers & Line Drivers 2-3.6V Quad 3-State Non-Inverting
Lifecycle:
New from this manufacturer.
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