Datasheet
www.rohm.com TSZ02201-0RAR1G200640-1-2
©2013 ROHM Co., Ltd. All rights reserved.
15/17
1.Mar.2013 Rev.001
TSZ22111･15･001
BA4560Yxxx-M
●Operational Notes
1) Processing of unused circuit
It is recommended to apply connection (see the Figure 30.) and set the non
inverting input terminal at the potential within input common-mode voltage range
(Vicm), for any unused circuit.
2) Input voltage
Applying (VEE - 0.3) to (VEE + 36)V
(BA4558R)
to the input terminal is possible without causing deterioration of the
electrical characteristics or destruction, irrespective of the supply voltage.
However, this does not ensure normal circuit operation. Please note that the
circuit operates normally only when the input voltage is within the common mode
input voltage range of the electric characteristics.
3) Maximum output voltage
Because the output voltage range becomes narrow as the output current
Increases, design the application with margin by considering changes in
electrical characteristics and temperature characteristics.
4) Short-circuit of output terminal
When output terminal and VCC or VEE terminal are shorted, excessive Output
current may flow under some conditions, and heating may destroy IC. It is
necessary to connect a resistor as shown in Figure 31., thereby protecting
against load shorting.
5) Power supply (split supply / single supply) in used
Op-amp operates when specified voltage is applied between VCC and VEE.
Therefore, the single supply Op-Amp can be used for double supply Op-Amp as well.
6) Power dissipation (Pd)
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.
7) Short-circuit between pins and wrong mounting
Pay attention to the assembly direction of the ICs. Wrong mounting direction or shorts between terminals, GND, or other
components on the circuits, can damage the IC.
8) Use in strong electromagnetic field
Using the ICs in strong electromagnetic field can cause operation malfunction.
9) Radiation
This IC is not designed to be radiation-resistant.
10) IC Handling
When stress is applied to IC because of deflection or bend of board, the characteristics may fluctuate due to piezo
resistance effects.
11) Inspection on set board
During testing, turn on or off the power before mounting or dismounting the board from the test Jig. Do not power up the
board without waiting for the output capacitors to discharge. The capacitors in the low output impedance terminal can
stress the device. Pay attention to the electro static voltages during IC handling, transportation, and storage.
12) Output capacitor
When VCC terminal is shorted to VEE (GND) potential and an electric charge has accumulated on the external capacitor,
connected to output terminal, accumulated charge may be discharged VCC terminal via the parasitic element within the
circuit or terminal protection element. The element in the circuit may be damaged (thermal destruction). When using this IC
for an application circuit where there is oscillation, output capacitor load does not occur, as when using this IC as a
voltage comparator. Set the capacitor connected to output terminal below 0.1μF in order to prevent damage to IC.
application circuit for unused op-amp
Figure 30. The example of
Figure 31. The example of
output short protection
Connect
to Vicm
VCC
VEE
Vicm
-
+
VEE
VCC
+
-
protection
resistor
