Data Sheet ADP3050
Rev. C | Page 15 of 20
shows the approximate unity-gain frequency of the loop. Again,
always check the design over its full operating range of input
voltage, output current, and temperature to ensure that the loop
is compensated correctly.
In addition to setting the zero location, R
C
also sets the high
frequency gain of the error amplifier. If this gain is too large,
output ripple voltage appears at the COMP pin (the output of
the error amplifier) with enough amplitude to interfere with
normal regulator operation. If this occurs, subharmonic switching
results (the pulse width of the switch waveform changes, even
though the output voltage stays regulated). The voltage ripple at the
COMP pin should be kept below 100 mV to prevent subharmonic
switching from occurring. The amount of ripple can be estimated
by the following formula, where g
m
is the error amplifier
transconductance (g
m
= 1250 μMho):
( ) ( )
OUT
FB
RIPPLE
C
m
RIPPLECOMP
V
V
ESRIRgV ××××=
,
(10)
For example, a 12 V to 5 V, 800 mA regulator with an inductor of
L = 47 μH has I
RIPPLE
= 310 mA (see example from the Continuous
Mode section) if a 100 μF tantalum output capacitor with a
maximum ESR of 100 mΩ and compensation values of R
C
= 4 kΩ
and C
C
= 1 nF are used. The ripple voltage at the COMP pin is
( ) ( )
mV2.37
0.5
20.1
1.0310.0104101250
36
,
=
××××××=
RIPPLECOMP
V
(11)
If this ripple voltage is more than 100 mV, R
C
needs to be
decreased to prevent subharmonic switching. Typical values for
R
C
are in the range of 2 kΩ to 10 kΩ.
For output voltages greater than 5 V, it may be necessary to add
a small capacitor in parallel with R2, as shown in Figure 25.
This improves stability and transient response. For tantalum
output capacitors, the typical value for C
F
is 100 pF. For ceramic
output capacitors, the typical value for C
F
is 400 pF.
CURRENT LIMIT/FREQUENCY FOLDBACK
The ADP3050 uses a cycle-by-cycle current limit to protect the
device under fault and high stress conditions. When the current
limit is exceeded, the power switch turns off until the beginning
of the next oscillator cycle. If the voltage on the feedback pin
drops below 80% of its nominal value, the oscillator frequency
starts to decrease (see Figure 17 in the Typical Performance
Characteristics section). The frequency gradually reduces to a
minimum value of approximately 80 kHz (this minimum
occurs when the feedback voltage falls to 30% of its nominal
value). This reduces the power dissipation in the IC, the
external diode, and the inductor during short-circuit
conditions. This frequency foldback method provides complete
device fault protection without interfering with the normal
device operation.
BIAS PIN CONNECTION
To help improve efficiency, most of the internal operating
current can be drawn from the lower voltage regulated output
voltage instead of the input supply. For example, if the input
voltage is 24 V and the output voltage is 5 V, a quiescent current
of 4 mA wastes 96 mW if drawn from the input supply, but only
20 mW is drawn from the regulated 5 V output. This power
savings is most evident at high input voltages and low load
currents. The output voltage must be 3 V or higher to take
advantage of this feature.
BOOSTED DRIVE STAGE
An external capacitor and diode are used to provide the boosted
voltage needed for the special drive stage. If the output voltage is
above 4 V, connect the anode of the boost diode to the regulated
output; for output voltages less than or equal to voltages of 3 V,
connect it to the input supply. For some low voltage systems,
such as 5 V to 3.3 V converters, the anode of the boost diode
can be connected to either the input or output voltage. During
switch off time, the boost capacitor is charged up to the voltage
at the anode of the boost diode. When the switch turns on, this
voltage is added to the switch voltage (the boost diode is reverse-
biased), providing a voltage higher than the input supply. The
peak voltage appearing on the BOOST pin is the sum of the
input voltage and the boost voltage (either V
IN
+ V
OUT
or 2 × V
IN
).
Ensure that this peak voltage does not exceed the BOOST pin
maximum rating of 45 V.
For most applications, a 1N4148 or 1N914 type diode can be
used with a 220 nF capacitor. A 470 nF capacitor may be needed
for output voltages between 3 V and 4 V. The boost capacitor
should have an ESR of less than 2 Ω to ensure that it is adequately
charged up during switch off time. Almost any type of film or
ceramic capacitor can be used.
START-UP/MINIMUM INPUT VOLTAGE
For most designs, the regulated output voltage provides the
boosted voltage for the drive stage. During startup, the output
voltage is 0, so there is no boosted supply for the drive stage.
To deal with this problem, the ADP3050 contains a backup drive
stage to get everything started. As the output voltage increases,
so does the boost voltage. When the boost voltage reaches approx-
imately 2.5 V, the switch drives transition smoothly from the
backup driver to the boosted driver. If the boost voltage decreases
below approximately 2.5 V, resulting in a short-circuit or
overload condition, the backup stage takes over to provide switch
drive. The minimum input voltage needed for the ADP3050 to
function correctly is about 3.6 V (this ensures proper operation of
the internal circuitry), but a small amount of headroom is needed
for all step-down regulators. The following formula gives the
approximate minimum input voltage needed for a given system,
where V
SAT
is the switch saturation voltage (see Figure 15 for the
appropriate value of V
SAT
). Figure 13 also shows the typical
minimum input voltage needed for 3.3 V and 5 V systems.
ADP3050 Data Sheet
Rev. C | Page 16 of 20
85.0
)(
SATOUT
MININ
VV
V
+
=
(12)
THERMAL CONSIDERATIONS
Several factors contribute to IC power dissipation: ac and dc
switch losses, boost current, and quiescent current. The following
formulas are used to calculate these losses to determine the power
dissipation of the IC. These formulas assume continuous mode
operation, but they provide a reasonable estimate for disconti-
nuous mode systems (do not use these formulas to calculate
efficiency at light loads).
Switch loss
( )
SW
IN
OUT
OV
IN
OUT
SATOUT
SW
fVIt
V
V
VIP ×××+
××=
(13)
Boost current loss
IN
OUT
SW
OUT
BOOST
V
V
β
I
P
2
×=
(14)
Quiescent current loss
( )
( )
BIAS
OUT
Q
IN
Q
IVIVP ×+×=
(15)
where:
V
SAT
is ~0.6 V at I
OUT
= 800 mA (taken from Figure 15).
f
SW
is the switch frequency (200 kHz).
t
OV
is the switch current/voltage overlap time (~50 ns).
β
SW
is the current gain of the NPN power switch (~50).
I
Q
is the quiescent current drawn from V
IN
(~1 mA).
I
BIAS
is the quiescent current drawn from V
OUT
(~4 mA).
For example, a 5 V to 3.3 V system with I
OUT
= 800 mA
( )
mW357102000.5
8.01050
0.5
3.3
6.08.0
39
=×××××
+
××=
SW
P
mW35
0.5
3.3
50
8.0
2
=×=
BOOST
P
( ) ( )
mW181043.3105
33
=××+×=
Q
P
For a total IC power dissipation of
mW410
=++=
Q
BOOST
SW
TOTAL
PPPP
(16)
The ADP3050 is offered in a thermally enhanced (not Pb-free)
8-lead SOIC package with a thermal resistance, θ
JA
, of 60.6°C/W,
and in a standard Pb-free 8-lead SOIC package with θ
JA
of
87.5°C / W.
The maximum die temperature, T
J
, is calculated using the
thermal resistance and the maximum ambient temperature
TOTAL
JAA
J
PθTT
×+=
(17)
For the previous example (5 V to 3.3 V at 800 mA system, Pb-
free 8-lead SOIC package using good layout techniques) with a
worst-case ambient temperature of 70°C
T
J
= 70°C + 87.5°C/W × 0.41 = 105.9°C
The maximum operating junction (die) temperature is 125°C,
therefore this system operates within the safe limits of the
ADP3050. Check the die temperature at minimum and
maximum supply voltages to ensure proper operation under all
conditions. Although the PCB and its copper traces provide
sufficient heat sinking, it is important to follow the layout
suggestions in the Board Layout Guidelines section. For any
design that combines high output current with high duty cycle
and/or high input voltage, the junction temperature must be
calculated to ensure normal operation. Always use the
equations in this section to estimate the power dissipation.
Data Sheet ADP3050
Rev. C | Page 17 of 20
BOARD LAYOUT GUIDELINES
A good board layout is essential when designing a switching
regulator. The high switching currents along with parasitic
wiring inductances can generate significant voltage transients
and cause havoc in sensitive circuits. For best results, keep the
main switching path as tight as possible (keep L1, D1, C
IN
, and
C
OUT
close together) and minimize the copper area of the SWITCH
and BOOST nodes (without violating current density require-
ments) to reduce the amount of noise coupling into other
sensitive nodes.
ADP3050
GND
IN
SWITCH
C
IN
V
IN
GND
D1
C
OUT
L1
V
OUT
GND
00125-026
Figure 26. Main Switching Path
The external components should be located as close to the
ADP3050 as possible. For best thermal performance, use wide
copper traces for all IC connections, and always connect the
GND pin to a large piece of copper or ground plane. The additional
copper improves heat transfer from the IC, greatly reducing the
package thermal resistance. Further improvements of the thermal
performance can be made by using multilayer boards and using
vias to transfer heat to the other layers. A single layer board
layout is shown in Figure 27. The amount of copper used for the
input, output, and ground traces can be reduced, but were made
large to improve the thermal performance. For the 5 V and 3.3 V
versions, leave out R1 and R2; for the adjustable version, remove
the trace that shorts out R2. Route all sensitive traces and compo-
nents, such as those associated with feedback and compensation,
away from the BOOST and SWITCH traces.
TYPICAL APPLICATIONS
5 V to 3.3 V Buck (Step-Down) Regulator
The circuit in Figure 28 shows the ADP3050 in a buck
configuration. It is used to generate 3.3 V regulated output from
5 V input voltage with the following specifications:
V
IN
= 4.5 V to 5.5 V
V
OUT
= 3.3 V
I
OUT
= 0.75 A
I
RIPPLE
= 0.4 A × 0.75 A = 0.3 A
V
OUT_RIPPLE
= 50 mV
OUTPUT
GROUND
INPUT
C1
L1
C3
D1
D2
R2 R1 CC RC
C2
ADP3050
00125-027
Figure 27. Recommended Board Layout
U1
ADP3050-3.3
V
IN
C3
0.22µF
D1
1N5817
GND
5V
C1
22µF
+
C2
0.01µF
L1
22µH
V
OUT
3.3V
R1
7.5kΩ
C4
1nF
D2
1N4148
+
C5
100µF
SD
1
2
3
4
8
7
6
5
00125-028
SWITCH
BOOST
BIAS
FB
IN
GND
SD
COMP
Figure 28. 5 V to 3.3 V Buck Regulator

ADP3050ARZ-RL

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 200kHz 1A Hi-VTG Step-Down
Lifecycle:
New from this manufacturer.
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