AOL1422
Symbol Min Typ Max Units
BV
DSS
30 V
1
T
J
=55°C
5
I
GSS
10
V
GS(th)
1 1.7 3 V
I
D(ON)
150 A
3 3.7
T
J
=125°C
4.2 5.2
4.4 5.4
g
FS
71 S
V
SD
0.69 1 V
I
S
85 A
C
iss
5450 6800 pF
C
oss
760 pF
C
rss
540 pF
R
g
1 1.5 Ω
Q
g
(10V)
84 112 nC
Q
g
(4.5V)
42 56 nC
Q
gs
12 nC
Q
gd
21 nC
t
D(on)
13 ns
t
r
9.8 ns
t
D(off)
49 ns
t
f
16 ns
t
rr
42 56
ns
Q
rr
31 nC
150
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Gate Source Charge
Gate resistance V
GS
=0V, V
DS
=0V, f=1MHz
Total Gate Charge
V
GS
=10V, V
DS
=15V, I
D
=20A
mΩ
Turn-On Rise Time
Turn-Off DelayTime
V
GS
=10V, V
DS
=15V, R
L
=0.75Ω,
R
GEN
=3Ω
Turn-Off Fall Time
Turn-On DelayTime
Gate Drain Charge
V
GS
=0V, V
DS
=15V, f=1MHz
SWITCHING PARAMETERS
Total Gate Charge
V
GS
=4.5V, I
D
=20A
I
S
=1A,V
GS
=0V
V
DS
=5V, I
D
=20A
Maximum Body-Diode Continuous Current
Input Capacitance
Output Capacitance
DYNAMIC PARAMETERS
R
DS(ON)
Static Drain-Source On-Resistance
Forward Transconductance
Diode Forward Voltage
Gate Threshold Voltage V
DS
=V
GS
I
D
=250µA
V
DS
=30V, V
GS
=0V
V
DS
=0V, V
GS
= ±16V
Zero Gate Voltage Drain Current
Gate-Body leakage current
µA
Electrical Characteristics (T
J
=25°C unless otherwise noted)
STATIC PARAMETERS
Parameter Conditions
I
DSS
Body Diode Reverse Recovery Charge
I
F
=20A, dI/dt=100A/µs
Body Diode Reverse Recovery Time
Drain-Source Breakdown Voltage
On state drain current
I
D
=250µA, V
GS
=0V
V
GS
=10V, V
DS
=5V
V
GS
=10V, I
D
=20A
Reverse Transfer Capacitance
I
F
=20A, dI/dt=100A/µs
A: The value of R
θJA
is measured with the device in a still air environment with T
A
=25°C. The power dissipation P
DSM
and current rating I
DSM
are based on T
J(MAX)
=150°C, using steady state junction-to-ambient thermal resistance.
B. The power dissipation P
D
is based on T
J(MAX)
=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C: Repetitive rating, pulse width limited by junction temperature T
J(MAX)
=175°C.
D. The R
θJA
is the sum of the thermal impedence from junction to case R
θJC
and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink,
assuming a maximum junction temperature of T
J(MAX)
=175°C. The SOA curve provides a single pulse rating.
G. These tests are performed with the device mounted on 1 in
2
FR-4 board with 2oz. Copper, in a still air environment with T
A
=25°C.
H. The maximum current rating is limited by bond-wires.
* This device is guaranteed green after date code 8P11 (June 1
ST
2008)
Rev3: Jul 2008
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
