Spec No. JELF243A-0034R-01 P.3/8
MURATA MFG.CO., LTD
Reference Only
No. Item Specification Test Method
7.5 Resistance to
Soldering Heat
Appearance : No damage
Inductance Change : within ± 5 %
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating:150±10°C / 60 to 90seconds
Solder Temperature:270±5°C
Immersion Time:10±1 s
Then measured after exposure in the room
condition for 24±2 hours.
8.Environmental Performance
(It shall be soldered on the substrate.)
No. Item Specification Test Method
8.1 Heat Resistance Appearance : No damage
Inductance Change : within ± 5 %
Q Change : within ± 20 %
Temperature : 85 °C ± 2 °C
Time : 1000 h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
8.2 Cold Resistance Temperature : - 40 °C ± 2 °C
Time : 1000 h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
8.3 Humidity Temperature : 40 °C ± 2 °C
Humidity : 90 %(RH) to 95 %(RH)
Time : 1000 h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
8.4 Temperature
Cycle
1 cycle :
1 step : - 40 °C ± 2 °C / 30 min ± 3 min
2 step : Ordinary temp. / 10 min to 15 min
3 step : + 85 °C ± 2 °C / 30 min ± 3 min
4 step : Ordinary temp. / 10 min to 15 min
Total of 10 cycles
Then measured after exposure in the room condition
for 24±2 hours.
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
Dimension of the Cavity is measured at the bottom side.
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
2,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are
not continuous. The specified quantity per reel is kept.
3.6±0.1
φ
1.5
1.9±0.1
4.0±0.1
2.0±0.05
4.0±0.1
+0.1
-0
1.75±0.1
3.5±0.05
8.0±0.2
2.0±0.1
0.2
※
Lead- in / out wire
Direction of feed
(in mm)
※
The packing directions of the chip coil
in taping are unified with the in/out
positions of the lead wire.
( )
