1024-Bit, 1-Wire EEPROM
DS2431
26 Maxim Integrated
Revision History
REVISION
NUMBER
REVISION
DATE
DESCRIPTION
PAGES
CHANGED
0 050704 Initial release ——
Replaced Pin Configuration 1
In the Electrical Characteristics table, changed V
TL(MIN)
from 0.5V to 0.46V and
V
TL(MAX)
from 4.1V to 4.4V; changed V
HY(MIN)
from 0.22V to 0.21V
2
1 081604
In the Copy Scratchpad [55h] section, corrected the copy time from 13ms to 12.5ms 14
Added the SFN package and updated the Ordering Information table 1, 24
In the Pin Configuration, added a note to the CSP package outline “*See package
reliability report for important guidelines on qualified usage conditions.”
1
In the Electrical Characteristics table, changed the t
PROG
(programming time) EC
table parameter from 12.5ms to 10ms for version A2 (see also pages 1, 13).
Removed t
FPD
and updated t
PDH
, t
MSP
, t
W0L
accordingly. Changed I
PROG
max to
0.8mA to match GBD
1, 2, 3, 13
2 090506
Updated Memory Function Example table 23
Added CSP package outline drawing number to Pin Configuration 1
Changed V
TL(MIN)
from 0.46V to 0.5V in the Electrical Characteristics table 2
3 122106
In the Absolute Maximum Ratings, changed storage temp to -55°C to +125°C; in the
Electrical Characteristics table, changed V
TH
, V
TL
based on V
PUP
and data retention
to 40 years min at 85°C; added note to retention spec: “EEPROM writes can become
nonfunctional after the data-retention time is exceeded. Long-term storage at
elevated temperatures is not recommended; the device can lose its write capability
after 10 years at +125°C or 40 years at +85°C.”
1, 2, 3
In the Ordering Information table, removed all leaded part numbers and added the
TDFN-EP package
1, 24
In the Electrical Characteristics table, changed the V
IL(MAX)
spec from 0.3V to 0.5V;
removed from the t
W1L(MAX)
spec; added Note 17 to t
W0L
spec; updated EC table
Notes 17 and 18; corrected Note 20
2, 3
Added EP function to the Pin Description table 3
Added to Figure 11 Write-Zero Time Slot 19
4 102207
In the Pin Configuration, added the package drawing information/weblink and a note
that the SFN package is qualified for electro-mechanical contact applications only,
not for soldering. Added the SFN Package Orientation on Tape-and-Reel section. In
the Ordering Information, added note to contact factory for availability of the UCSPR
package. Added note that TO-92 T&R leads are formed to approximately 100-mil
spacing
24
In the SFN Pin Configuration, added reference to Application Note 4132 24
5 032008
Added Package Information table 25
6 8/08 Created newer template-style data sheet All
7 6/09
Deleted “contact factory” note in Ordering Information; updated Pin Description and
Pin Configurations to reflect changes in pin assignment of UCSPR package
1, 5, 23
8 10/09 Corrected part number in Ordering Information table 1
9 12/10 Deleted the automotive version reference in the Features section 1
10 3/11 Added the automotive version reference to the Features section 1
