TS33010
Final
Rev
June 2
,
2016
10 of
Mold compound
Die
Epoxy Die attach
Exposed pad
Solder
5% - 10% Cu coverage
Single Layer, 2oz Cu
Ground Layer, 1oz Cu
Signal Layer, 1oz Cu
Bottom Layer, 2oz Cu
Thermal Vias with Cu plating
90% Cu coverage
20% Cu coverage
Note: NOT to Scale
The above drawing is a representation of how the heat can be conducted away from the die using an exposed pad
package. Each application will have different requirements and limitations and therefore the user should use sufficient
copper to dissipate the power in the system. The output current rating for the linear regulators may have to be de-rated for
ambient temperatures above 85°C. The de-rate value will depend on calculated worst case power dissipation and the
thermal management implementation in the application.
Application Using A Single Layer
PCB
Use as much Copper Area
as possible for heat spread
Package Thermal Pad
Package Outline
Layout recommendations for a Single Layer PCB: utilize as much Copper Area for Power Management. In a single
layer board application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance
attachment method (solder paste or thermal conductive epoxy).
In both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat.
IMPORTANT
:
If the attachment method is NOT implemented correctly, the functionality of the product is not guaranteed. Power
dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board.
