NTMFS6B05NT3G

© Semiconductor Components Industries, LLC, 2015
February, 2015 − Rev. 1
1 Publication Order Number:
NTMFS6B05N/D
NTMFS6B05N
Power MOSFET
100 V, 8 mW, 104 A, Single N−Channel
Features
Small Footprint (5x6 mm) for Compact Design
Low R
DS(on)
to Minimize Conduction Losses
Low Q
G
and Capacitance to Minimize Driver Losses
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage V
DSS
100 V
Gate−to−Source Voltage V
GS
±20 V
Continuous Drain
Current R
q
JC
(Notes 1, 2, 3)
Steady
State
T
C
= 25°C
I
D
104
A
T
C
= 100°C 66
Power Dissipation
R
q
JC
(Notes 1, 2)
T
C
= 25°C
P
D
138
W
T
C
= 100°C 56
Continuous Drain
Current R
q
JA
(Notes 1, 2, 3)
Steady
State
T
A
= 25°C
I
D
16
A
T
A
= 100°C 10
Power Dissipation
R
q
JA
(Notes 1 & 2)
T
A
= 25°C
P
D
3.3
W
T
A
= 100°C 1.3
Pulsed Drain Current
T
A
= 25°C, t
p
= 10 ms
I
DM
370 A
Operating Junction and Storage Temperature T
J
, T
stg
55 to
+ 150
°C
Source Current (Body Diode) I
S
130 A
Single Pulse Drain−to−Source Avalanche
Energy (I
L(pk)
= 50 A)
E
AS
125 mJ
Lead Temperature for Soldering Purposes
(1/8 from case for 10 s)
T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol Value Unit
Junction−to−Case − Steady State
R
q
JC
0.9
°C/W
Junction−to−Ambient − Steady State (Note 2)
R
q
JA
39
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Surface−mounted on FR4 board using a 650 mm
2
, 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
MARKING
DIAGRAM
www.onsemi.com
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
6B05N
AYWZZ
V
(BR)DSS
R
DS(ON)
MAX I
D
MAX
100 V 8 mW @ 10 V
104 A
G (4)
S (1,2,3)
N−CHANNEL MOSFET
D (5)
S
S
S
G
D
D
D
D
DFN5
(SO−8FL)
CASE 488AA
STYLE 1
1
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
ORDERING INFORMATION
NTMFS6B05N
www.onsemi.com
2
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise specified)
Parameter
Symbol Test Condition Min Typ Max Unit
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
V
(BR)DSS
V
GS
= 0 V, I
D
= 250 mA
100 V
Drain−to−Source Breakdown Voltage
Temperature Coefficient
V
(BR)DSS
/
T
J
73
mV/°C
Zero Gate Voltage Drain Current I
DSS
V
GS
= 0 V,
V
DS
= 80 V
T
J
= 25 °C 10
mA
T
J
= 125°C 100
Gate−to−Source Leakage Current I
GSS
V
DS
= 0 V, V
GS
= 20 V 100 nA
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
V
GS(TH)
V
GS
= V
DS
, I
D
= 250 mA
2.0 4.0 V
Threshold Temperature Coefficient V
GS(TH)
/T
J
−7.9 mV/°C
Drain−to−Source On Resistance R
DS(on)
V
GS
= 10 V I
D
= 20 A 6.5 8.0
mW
V
GS
= 6.0 V I
D
= 10 A 9.6 14
CHARGES, CAPACITANCES & GATE RESISTANCE
Input Capacitance
C
ISS
V
GS
= 0 V, f = 1 MHz, V
DS
= 50 V
3100
pF
Output Capacitance C
OSS
570
Reverse Transfer Capacitance C
RSS
28
Total Gate Charge Q
G(TOT)
V
GS
= 10 V, V
DS
= 50 V; I
D
= 25 A
44
nC
Threshold Gate Charge Q
G(TH)
5.0
Gate−to−Source Charge Q
GS
14
Gate−to−Drain Charge Q
GD
12
Plateau Voltage V
GP
5.0 V
Gate Resistance R
G
T
J
= 25 °C 1.0
W
SWITCHING CHARACTERISTICS (Note 5)
Turn−On Delay Time
t
d(ON)
V
GS
= 10 V, V
DS
= 50 V,
I
D
= 25 A, R
G
= 1.0 W
14
ns
Rise Time t
r
43
Turn−Off Delay Time t
d(OFF)
39
Fall Time t
f
16
DRAIN−SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
V
SD
V
GS
= 0 V,
I
S
= 25 A
T
J
= 25°C 0.9 1.2
V
T
J
= 125°C 0.8
Reverse Recovery Time t
RR
V
GS
= 0 V, dI
S
/d
t
= 100 A/ms,
I
S
= 25 A
58
ns
Charge Time t
a
30
Discharge Time t
b
28
Reverse Recovery Charge Q
RR
83 nC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
5. Switching characteristics are independent of operating junction temperatures.
NTMFS6B05N
www.onsemi.com
3
TYPICAL CHARACTERISTICS
Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V) V
GS
, GATE−TO−SOURCE VOLTAGE (V)
3.01.00
0
20
100
54210
Figure 3. On−Resistance vs. Gate−to−Source
Voltage
Figure 4. On−Resistance vs. Drain Current and
Gate Voltage
V
GS
, GATE VOLTAGE (V) I
D
, DRAIN CURRENT (A)
9.08.07.0 107.56.56.04.5
4
12
25 302015
8
10
4
Figure 5. On−Resistance Variation with
Temperature
Figure 6. Drain−to−Source Leakage Current
vs. Voltage
T
J
, JUNCTION TEMPERATURE (°C) V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
15012510075250−25−50
0.8
1.2
1005040302010
10K
I
D
, DRAIN CURRENT (A)
I
D
, DRAIN CURRENT (A)
R
DS(on)
, DRAIN−TO−SOURCE RESISTANCE (mW)
R
DS(on)
, DRAIN−TO−SOURCE RESISTANCE (mW)
R
DS(on)
, NORMALIZED DRAIN−TO
SOURCE RESISTANCE
I
DSS
, LEAKAGE (nA)
4.5 V
4.0 V
V
DS
10 V
T
J
= 25°C
T
J
= 125°C
T
J
= −55°C
10
I
D
= 20 A
T
J
= 25°C
V
GS
= 6.0 V
T
J
= 25°C
V
GS
= 10 V
50
I
D
= 20 A
V
GS
= 10 V
T
J
= 25°C
T
J
= 125°C
3
6
14
1.0
0.4
1.4
18
120
10
7.0 V
2.0
0
40
100
80
140
20
120
20
6
1.8
2.0
60
80
15
2.5
5.5 V
V
GS
= 10 V
40
140
60
5.0 45 5035 40
0.6
100
10
1
0.5 1.5
5.5 8.5 9.5
8
16
12
14
1.6
T
J
= 150°C
1K
100K
6.5 V
5.0 V
6.0 V
67
7
9
5
11
13
60 70 80 90

NTMFS6B05NT3G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET NFET SO8FL 100V 104A 7.7M
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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