B251
DF13 Series●1.25mm Pitch Miniature Crimping Connector
1. Recommended Temperature
Profile (SMT)
Note 1.Up to 2 cycles of Reflow soldering are possible under the same conditions, provided
that there is a return to normal temperature between the first and second cycle.
Note 2.The temperature profile indicates the board surface temperature at the point of
contacts with the connector terminals.
Note 3.Slight variations in color of the plastic compounds do not affect form, fit or function of
the connector.
2. Recommended Soldering
Condition (SMT)
Manual soldering: 290±10ç for 2 seconds max.
3. Recommended Screen
Thickness (SMT)
0.15 to 0.2mm
4. Board Warpage (SMT) Max 0.03mm in the connector center area, based on both connector edges
5. Recommended Soldering
Flow: 250±5ç for 3 seconds
5. Condition (Through hole)
Manual soldering: 290±10ç for 2 seconds
6. Cleaning Condition Refer to Nylon Connector Use Hand book.
7. Connection Condition Refer to Nylon Connector Use Hand book.
■Carefully carry out the crimping operation according to "Crimping Condition Sheet" and
"Crimping Quality Standard", because the crimping contact is an extremely small style.
8. Cautions ■Be careful for the excessive scoop insertion/extraction, which will cause damage to the product.
9. Precautions Refer to Nylon Connector Use Hand book.
BPrecautions
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
