5
©2009 Littelfuse, Inc.
SPA™ Silicon Protection Array Products
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
Low Capacitance Diode Array for ESD and Surge Protection
SP3050 Lead-Free/Green Series
Lead-Free/Green SP3050
Package Dimensions - SOT23-6
Package SOT23-6
Pins 6
JEDEC MO-203 Issue A
Millimeters Inches
Notes
Min Max Min Max
A 0.900 1.450 0.035 0.057 -
A1 0.000 0.150 0.000 0.006 -
A2 0.900 1.300 0.035 0.051 -
b 0.350 0.500 0.0138 0.0196 -
C 0.080 0.220 0.0031 0.009 -
D 2.800 3.000 0.11 0.118 3
E 2.600 3.000 0.102 0.118 -
E1 1.500 1.750 0.06 0.069 3
e 0.95 Ref 0.0374 ref -
e1 1.9 Ref 0.0748 Ref -
L 0.100 0.600 0.004 0.023
N 666
a 0º 10º 0º 10º -
M 2.590 0.102 -
O 0.690 .027 TYP -
P 0.990 .039 TYP -
R 0.950 0.038 -
O
P
R
M
Recommended Solder Pad Layout
/PUFT
%JNFOTJPOJOHBOEUPMFSBODFTQFS"/4*.
1BDLBHFDPOGPSNTUP&*"+4$
%JNFOTJPOT%BOE&BSFFYDMVTJWFPGNPMEnBTIQSPUSVTJPOTPSHBUFCVSST
'PPUMFOUI-NFBTVSFEBUSFGFSFODFUPTFBUJOHQMBOF
i-wJTUIFMFOHUIPGnBUGPPUTVSGBDFGPSTPMEFSJOHUPTVCTUSBUF
i/wJTUIFOVNCFSPGUFSNJOBMQPTJUJPOT
$POUSPMJOHEJNFOTJPO.*--*.&5&3$POWFSUFEJODIEJNFOTJPOTBSFOPUOFDFTTBSJMZ
FYBDU
Reflow Condition 1Co'SFFBTTFNCMZ
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (min to max) (t
s
) 60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
L
) to peak
¡$TFDPOENBY
T
S(max)
to T
L
- Ramp-up Rate ¡$TFDPOENBY
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 250
+0/-5
°C
Time within 5°C of actual peak
Temperature (t
p
)
20 – 40 seconds
Ramp-down Rate ¡$TFDPOENBY
Time 25°C to peak Temperature (T
P
) NJOVUFT.BY
Do not exceed 260°C
Soldering Parameters
