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695D686X0015H2T

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P22
Conformal Coated Guide
www.vishay.com
Vishay Sprague
Revision: 11-Apr-16
9
Document Number: 40150
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CWR06 / CWR16 / CWR26 - 194D - 695D
A 0.065 [1.6] 0.50 [1.3] 0.040 [1.0]
B 0.065 [1.6] 0.70 [1.8] 0.055 [1.4]
C 0.065 [1.6] 0.70 [1.8] 0.120 [3.0]
D 0.115 [2.9] 0.70 [1.8] 0.070 [1.8]
E 0.115 [2.9] 0.70 [1.8] 0.120 [3.0]
F 0.150 [3.8] 0.70 [1.8] 0.140 [3.6]
G 0.125 [3.2] 0.70 [1.8] 0.170 [4.3]
H 0.165 [4.2] 0.90 [2.3] 0.170 [4.3]
T95
B 0.120 [3.0] 0.059 [1.5] 0.059 [1.5]
C 0.136 [3.5] 0.090 [2.3] 0.120 [3.1]
D 0.180 [4.6] 0.090 [2.3] 0.136 [3.47]
R 0.248 [6.3] 0.090 [2.3] 0.140 [3.6]
S 0.080 [2.03] 0.040 [1.02] 0.040 [1.02]
V 0.114 [2.9] 0.040 [1.02] 0.040 [1.02]
X, Y, Z 0.114 [2.9] 0.065 [1.65] 0.122 [3.1]
14002
B 0.120 [3.0] 0.059 [1.5] 0.059 [1.5]
C 0.136 [3.5] 0.090 [2.3] 0.120 [3.1]
D 0.180 [4.6] 0.090 [2.3] 0.136 [3.47]
R 0.248 [6.3] 0.090 [2.3] 0.140 [3.6]
T96
R 0.248 [6.3] 0.090 [2.3] 0.140 [3.6]
597D - T97 - T98 - 13008
D, E, V 0.196 [4.9] 0.090 [2.3] 0.140 [3.6]
F, R, Z 0.260 [6.6] 0.090 [2.3] 0.140 [3.6]
M, H, N 0.284 [7.2] 0.090 [2.3] 0.140 [3.6]
PAD DIMENSIONS in inches [millimeters]
CASE CODE WIDTH (A) PAD METALLIZATION (B) SEPARATION (C)
A
C
B
B
PAD DIMENSIONS in inches [millimeters]
CASE CODE WIDTH (A) PAD METALLIZATION (B) PAD METALLIZATION (B
1
) SEPARATION (C)
572D
A 0.079 [2.0] 0.039 [1.0] 0.035 [0.9] 0.047 [1.2]
Q 0.079 [2.0] 0.039 [1.0] 0.035 [0.9] 0.047 [1.2]
S 0.079 [2.0] 0.039 [1.0] 0.035 [0.9] 0.047 [1.2]
B 0.110 [2.8] 0.039 [1.0] 0.035 [0.9] 0.055 [1.4]
P 0.055 [1.4] 0.024 [0.6] 0.024 [0.6] 0.035 [0.9]
T 0.110 [2.8] 0.035 [0.9] 0.031 [0.8] 0.055 [1.4]
A
C
B
B
1
Conformal Coated Guide
www.vishay.com
Vishay Sprague
Revision: 11-Apr-16
10
Document Number: 40150
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
RECOMMENDED REFLOW PROFILES
Capacitors should withstand reflow profile as per J-STD-020 standard
PROFILE FEATURE SnPb EUTECTIC ASSEMBLY LEAD (Pb)-FREE ASSEMBLY
Preheat / soak
Temperature min. (T
s min.
) 100 °C 150 °C
Temperature max. (T
s max.
) 150 °C 200 °C
Time (t
s
) from (T
s
min.
to T
s max.
) 60 s to 120 s 60 s to 120 s
Ramp-up
Ramp-up rate (T
L
to T
p
) 3 °C/s max. 3 °C/s max.
Liquidous temperature (T
L
) 183 °C 217 °C
Time (t
L
) maintained above T
L
60 s to 150 s 60 s to 150 s
Peak package body temperature (T
p
) Depends on type and case – see table below
Time (t
p
)* within 5 °C of the specified
classification temperature (T
c
)
20 s 30 s
Ramp-down
Ramp-down rate (T
p
to T
L
) 6 °C/s max. 6 °C/s max.
Time 25 °C to peak temperature 6 min max. 8 min max.
PEAK PACKAGE BODY TEMPERATURE (T
p
)
TYPE / CASE CODE
PEAK PACKAGE BODY TEMPERATURE (T
p
)
SnPb EUTECTIC PROCESS LEAD (Pb)-FREE PROCESS
591D / 592D - all cases, except X25H, M and R cases 235 °C 260 °C
591D / 592D - X25H, M and R cases 220 °C 250 °C
594D / 595D - all cases except C, D, and R 235 °C 260 °C
594D / 595D - C, D, and R case 220 °C 250 °C
572D all cases n/a 260 °C
T95 B, S, V, X, Y cases 235 °C 260 °C
T95 B, S, V, X, Y cases 235 °C 260 °C
T95 B, S, V, X, Y cases 235 °C 260 °C
T95 C, D, R, and Z cases 220 °C 250 °C
14002 B case 235 °C n/a
14002 C, D, and R cases 220 °C n/a
T96 R case 220 °C 250 °C
195D all cases, except G, H, R, and Z 235 °C 260 °C
195D G, H, R, and Z cases 220 °C 250 °C
695D all cases, except G and H cases 235 °C 260 °C
695D G, H cases 220 °C 250 °C
597D, T97, T98 all cases, except V case 220 °C 250 °C
597D, T97, T98 V case 230 °C 260 °C
194D all cases, except H and G cases 235 °C 260 °C
194D H and G cases 220 °C 250 °C
25
TEMPERATURE (°C)
TIME (s)
t
s
t
L
Time 25 °C to peak
T
L
T
p
T
C
- 5 °C
t
p
T
s max.
T
s min.
Preheat area
Max. ramp-up rate = 3 °C/s
Max. ramp-down rate = 6 °C/s
Conformal Coated Guide
www.vishay.com
Vishay Sprague
Revision: 11-Apr-16
11
Document Number: 40150
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
GUIDE TO APPLICATION
1. AC Ripple Current: the maximum allowable ripple
current shall be determined from the formula:
where,
P = power dissipation in W at +25 °C as given in
the tables in the product datasheets (Power
Dissipation).
R
ESR
= the capacitor equivalent series resistance at
the specified frequency
2. AC Ripple Voltage: the maximum allowable ripple
voltage shall be determined from the formula:
or, from the formula:
where,
P = power dissipation in W at +25 °C as given in
the tables in the product datasheets (Power
Dissipation).
R
ESR
= the capacitor equivalent series resistance at
the specified frequency
Z = the capacitor impedance at the specified
frequency
2.1 The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
2.2 The sum of the negative peak AC voltage plus
the applied DC voltage shall not allow a voltage
reversal exceeding 10 % of the DC working voltage
at +25 °C.
3. Reverse Voltage: solid tantalum capacitors are not
intended for use with reverse voltage applied.
However, they have been shown to be capable of
withstanding momentary reverse voltage peaks of up
to 10 % of the DC rating at 25 °C and 5 % of the DC
rating at +85 °C.
4. Temperature Derating: if these capacitors are to be
operated at temperatures above +25 °C, the
permissible RMS ripple current shall be calculated
using the derating factors as shown:
5. Power Dissipation: power dissipation will be
affected by the heat sinking capability of the
mounting surface. Non-sinusoidal ripple current may
produce heating effects which differ from those
shown. It is important that the equivalent I
RMS
value
be established when calculating permissible
operating levels. (Power dissipation calculated using
derating factor (see paragraph 4)).
6. Attachment:
6.1 Soldering: capacitors can be attached by
conventional soldering techniques, convection,
infrared reflow, wave soldering and hot plate
methods. The soldering profile chart shows typical
recommended time / temperature conditions for
soldering. Preheating is recommended to reduce
thermal stress. The recommended maximum preheat
rate is 2 °C/s. Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
7. Recommended Mounting Pad Geometries: the nib
must have sufficient clearance to avoid electrical
contact with other components. The width
dimension indicated is the same as the maximum
width of the capacitor. This is to minimize lateral
movement.
8. Cleaning (Flux Removal) After Soldering:
T
ANTAMOUNT™ capacitors are compatible with all
commonly used solvents such as TES, TMS, Prelete,
Chlorethane, Terpene and aqueous cleaning media.
However, CFC / ODS products are not used in the
production of these devices and are not
recommended. Solvents containing methylene
chloride or other epoxy solvents should be avoided
since these will attack the epoxy encapsulation
material.
TEMPERATURE DERATING FACTOR
+25 °C 1.0
+85 °C 0.9
+125 °C 0.4
I
RMS
P
R
ESR
------------=
V
RMS
I
RMS
x Z=
V
RMS
Z
P
R
ESR
------------=
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P22

695D686X0015H2T

Mfr. #:
Buy 695D686X0015H2T
Manufacturer:
Vishay
Description:
Tantalum Capacitors - Solid SMD 68uF 15volts 20% H case Conformal
Lifecycle:
New from this manufacturer.
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