DLW43SH510XK2L

Spec No.
JEFL243C-9101M-01 P4/9
MURATA MFG.CO., LTD
Reference Only
2.7±0.1
0.3±0.05
8.0±0.1
4.0±0.1
φ
1.5±
4.9±0.1
5.5
12.0±0.2
2.0±0.05
0.1
0
3.6±0.1
1.75±0.1
±0.05
(in mm)
Direction of feed
10. P.C.B., Flux, Solder and Soldering condition
Test shall be done using P.C.B., Flux, Solder and Soldering condition which are
specified in item 13 except the case of being specified special condition.
11. Specification of Packaging
11.1 Appearance and Dimensions ( 12mm-wide,Plastic tape)
*
Dimension of the Cavity is measured
at the bottom side.
11.2. Specification of Taping
(1) Packing quantity (Standard quantity) φ 180 mm reel : 500 pcs. / reel φ 330 mm reel : 2500 pcs. / reel
(2) Packing Method
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
The cover tape have no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
11.3. Pull Strength of Plastic Tape
Plastic Tape 5 N min.
Cover Tape 10 N min.
11.4. Peeling off force of Cover Tape
0.2N to 0.7N (minimum value is typical.)
Speed of Peeling off : 300 mm / min
11.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows.
« Packaging Code : L (Φ180mm reel) »
« Packaging Code : K (Φ330mm reel) »
165 to 180 degree
F
Cover tape
Plastic tape
160 min.
210 min.
190 min.
φ
13.0±0.2
φ
21.0±0.8
φ
180±
φ
60±
13±
17±1.4
1
0
0
3
Direction of feed
Trailer
1
0
Leader
Empty Tape
Cover tape
(in mm)
Label
2.0±0.5
2.0±0.5
φ
13.0±0.5
φ
21.0±0.8
φ
330±2.0
φ
50 min.
14±1.5
2.0±0.5
(in mm)
210 min.
190 min.
Leader
Empty Tape
Cover tape
Direction of feed
Trailer
160 min.
Label
Spec No.
JEFL243C-9101M-01 P5/9
MURATA MFG.CO., LTD
Reference Only
11.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity, etc
1) « Expression of Inspection No. » □□
OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y
()
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
11.7 Marking for Outside package
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking (2), Quantity, etc
11.8 Specification of Outer Case
*Above Outer Case size is typical. It depends on a quantity of an order.
12.
!
Caution
12.1 Mounting Direction
Mount products in right direction.
Wrong direction which is 90°rotated from right direction causes not only open or short circuit but also
flames or other serious trouble.
12.2 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment (6) Transportation equipment (trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and / or reliability requirements
to the applications listed in the above.
12.3 Caution(Rating)
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and
short/open circuit of the product or falling off the product may be occurred.
12.4 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be
caused by the abnormal function or the failure of our product.
13. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1 Flux and Solder
Flux Use rosin-based flux,(with converting chlorine content 0.06 to 0.1(wt)%. ),
but not highly acidic flux
(with Halogen content exceeding 0.2(wt)% conversion to chlorine).
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Standard thickness of the solder paste should be 150µm.
Reel
Outer Case Dimensions
(mm)
Standard Reel
Quantity in
Outer Case
(Reel)
W D H
φ180mm
186 186 93
4
φ330mm
340 340 85
4
right direction
wrong direction
W
D
Label
H
Spec No.
JEFL243C-9101M-01 P6/9
MURATA MFG.CO., LTD
Reference Only
13.2 Assembling
<Exclusive use of Reflow soldering>
Flow soldering may cause deterioration in insulation resistance.
So, reflow soldering shall be applied for this product.
13.3 Cleaning Conditions
Do not clean after soldering. Some cleaning agents may degrade bonding strength,and
characteristics of products by detaching. If cleaning,please contact us.
13.4 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open
circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under
some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful
attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin,
please make sure no reliability issue is observed by evaluating products mounted on your board.
13.5 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
Products direction
Products shall be location the sideways
Direction (Length : a<b) to the mechanical
Stress.
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3)
Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Poor example
Good example
b
a
Screw Hole
Recommended
Perforation
Slit
A
B
C
D

DLW43SH510XK2L

Mfr. #:
Manufacturer:
Murata Electronics
Description:
Common Mode Chokes / Filters 1812 51uH@1MHz Tol -30%/+50%
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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