LTC1955
13
1955fd
For more information www.linear.com/LTC1955
V
CCA
/V
CCB
undervoltage faults are determined by compar-
ing the actual output voltage with the internal reference
voltage. If the output is more than ~5% below its set point
for the entire timeout period, the fault is reported and the
deactivation sequence is initiated.
V
CCA
/V
CCB
overcurrent faults are detected by comparing
the output current of the LDOs with an internal reference
level. If the current of an LDO is more than 100mA (typ)
for the entire timeout period, the fault is reported and the
deactivation sequence is initiated.
CLK A/CLK B and RST A/RST B faults are detected by
comparing the outputs of these pins with their expected
signals. If the signal on a pin is incorrect for the entire
timeout period, the fault is reported and the deactivation
sequence is initiated.
The clock channels are a special case. Since they can have
a free running clock, the error indication is accumulated
over a longer period of time without being cleared. Even
though the clock may be running, an error will still be
detected.
An overtemperature fault is detected by sensing the junction
temperature of the IC. If the junction temperature exceeds
approximately 150°C for the entire timeout period, the
fault is reported by setting both fault bits (D4 and D12)
and the deactivation sequence is initiated.
A card removal fault is determined as soon as the PRES A/
PRES B pin is high (for NC/NO = 0). Once this occurs,
the fault is reported and the deactivation sequence is
initiated.
If no card is present, and the application software attempts
to power-up a card socket, an automatic fault will result
on that channel.
Short-circuits on the I/O A/I/O B lines will not be detected
by the fault detection hardware; however, a short-circuit
from these lines to their respective V
CCA
/V
CCB
pins will
be compliant with the maximum current limits set by ap-
plicable standards (<15mA).
An
electrical fault can be cleared on either channel by
setting the voltage of that channel to 0V. Set D0 and D1
to
OO to clear channel B and set D8 and D9 to 00 to clear
channel A. It is not necessary to set all four bits to zeros.
Answer to Reset (ATR) Fault Detection
Answer to reset faults are detected by an internal counter
that is started once the RST A/B line goes high. If the DATA
pin remains high for 40,000 clock cycles, the ATR fault bit
for a given channel is set in the serial port’s status register
(see Table 1) and the FAULT pin is brought low.
An ATR fault cannot occur if the clock mode of a chan
-
nel is set to synchronous. ATR faults will only occur for
asynchronous smart cards.
A
TR faults are cleared by bringing the RST A/B pin low
for the faulted channel. This will also clear the FAULT pin
to the Hi-Z state (assuming no other errors are causing
FAULT to be low).
An ATR fault will not automatically deactivate a card
channel. It is the application programmers responsibility
to check the status register for ATR faults and deacti
-
vate the smart card channel in accordance with smart
card standards. Generally, the application has 50ms
(EMV 2.1.3.1, 2.1.3.2) from the 40,000th clock pulse to
deactivate the card. Once the LTC1955 receives the de-
activation command, it will shut down a card channel in
less than 250µs.
Using the
FAULT Pin
The FAULT pin can be used as an interrupt to a microcon
-
troller. It is an open-drain output and generally requires
a pull-up resistor
. The FAULT pin will go low when either
an electrical fault, or an answer to reset fault, occurs on
either channel. Thus, there are four possible faults that
can cause it to indicate a problem. The serial port’s status
register must be polled to find out what type of fault oc
-
curred and on which channel. The FAULT pin is logically
equivalent to D4 + D5 + D12 + D13 (see Table 1).
operaTion
LTC1955
14
1955fd
For more information www.linear.com/LTC1955
10kV ESD Protection
All smart card pins (CLK A/CLK B, RST A/RST B, I/O A/I/O B,
C4A, C8A and V
CCA
/V
CCB
) can withstand over 10kV of
human body model ESD in-situ. In order to ensure proper
ESD protection, careful board layout is required. The
PGND and SGND pins should be tied directly to a ground
plane. The V
CCA
/V
CCB
capacitors should be located very
close to the V
CCA
/V
CCB
pins and tied immediately to the
ground plane.
Capacitor Selection
Warning: A polarized capacitor such as tantalum or alumi
-
num should never be used for the flying capacitor since
its voltage can reverse upon start-up of the L
TC1955.
Low ESR ceramic capacitors should always be used for
the flying capacitor.
A total of six capacitors are required to operate the LTC1955.
An input bypass capacitor is required at PV
BATT
, SV
BATT
and DV
CC
. Output bypass capacitors are required on each
of the smart card V
CCA
/V
CCB
pins. A charge pump flying
capacitor is required from C
+
to C
and a charge storage
capacitor is required on the charge pump out pin CPO.
To prevent excessive noise spikes due to charge pump
operation, low ESR (equivalent series resistance) multi-
layer ceramic capacitors are strongly recommended.
There are several types of ceramic capacitors available, each
having considerably different characteristics. For example,
X7R/X5R ceramic capacitors have excellent voltage and
temperature stability but relatively low packing density.
Y5V ceramic capacitors have apparently higher packing
density but poor performance over their rated voltage or
temperature ranges. Under certain voltage and temperature
conditions, Y5V and X7R/X5R ceramic capacitors can be
compared directly by case size rather than specified value
for a desired minimum capacitance.
Placement of the capacitors is critical for correct operation
of the LTC1955. Because the charge pump generates large
current steps, all of the capacitors should be placed as close
to the LTC1955 as possible. The low impedance nature of
multilayer ceramic chip capacitors will minimize voltage
spikes but only if the power path is kept very short (i.e.,
minimum inductance). The PV
BATT
/SV
BATT
nodes should
applicaTions inForMaTion
be especially well bypassed. The capacitor for this node
should be directly adjacent to the QFN package. The CPO
and flying capacitors should be very close as well. The
LTC1955 can tolerate more distance between the LDO
capacitors and the V
CCA/B
pins.
Figure 3 shows an example of a tight printed circuit
board using single-layer copper. For best performance, a
multilayer board can be used and should employ a solid
ground plane on at least one layer.
The following capacitors are recommended for use with
the LTC1955.
TYPE VALUE CASE SIZE MURATA P/N
C
IN
CPO
X5R 4.7µF 0805 GRM40-034 X5R 475K 6.3
C
F LY
V
CCA/B
X5R 1µF 0603 GRM39 X5R 105K 6.3
CDV
CC
X5R 0.1µF 0402 GRM36 X5R 104K 10
Figure 3. Optimum Single-Layer PCB Layout
V
CCA
GND V
BATT
V
CCB
1955 F03
LTC1955
15
1955fd
For more information www.linear.com/LTC1955
Interfacing to a Microcontroller
The serial port of the LTC1955 can be connected directly
to a 68HC11 style microcontrollers serial port. The mcro
-
controller should be configured as the master device and
its clock’s idle state should be set to high (MSTR = 1,
CPOL = 1 and CPHA = 0 for the MC68HC11 family).
Figure
4 shows the recommended configuration and
direction of data flow. Note that an additional I/O line
is necessary for LD to load the data once it has shifted
around the loop. Command data is latched into the com
-
mand register on the falling edge of the LD
signal. The
LTC1955 will begin to act on new command data as soon
as LD goes low. Any general purpose microcontroller I/O
line can be configured to control the LD pin.
The status of the LTC1955 is returned over the serial
port. Status data is latched into the shift register on the
rising edge of the LD pin. Whenever the system is wait
-
ing for status data from the LTC1955, its LD pin should
be held low
.
Daisychained Operation
For applications requiring more than two card sockets,
the serial port of the LTC1955 is designed to be easily
daisychained. The D
OUT
pin of one LTC1955 can be con-
nected directly to the D
IN
pin of another LTC1955. Rather
than sending two 8-bit bytes before asserting LD, the
microcontroller should send two 8-bit bytes per device. LD
should only be asserted after all devices have been updated.
Figure 6 shows three LTC1955s cascaded in daisychain
fashion. In this case, the microcontroller would write six
8-bit bytes before asserting the LD pin. Alternatively, if
two serial ports are available on the microcontroller, then
two LTC1955s can be controlled independently.
If the DATA lines of two or more LTC1955s are connected
together, the static pull-up current will be the sum of the
devices. The static current can be brought back to the level
of a single LTC1955 by setting bit D3 on all but one of the
LTC1955s to 1 (see Table 1). Bit D3 disables the pull-up
current source on the DATA pin. This will help prevent V
OL
problems in multiple LTC1955 applications when driving
the DATA or I/O pins low.
CARD A
CARD B
1955 F04
D
IN
D
OUT
SCLK
LD
LTC1955
MOSI
MISO
SCK
I/O
µCONTROLLER
Figure 4. Microcontroller Interface
applicaTions inForMaTion

LTC1955EUH#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Interface - Specialized 2x Smart Card Int w/ Serial Control
Lifecycle:
New from this manufacturer.
Delivery:
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