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ADG783BCPZ-REEL7

P1-P3P4-P6P7-P9
REV.
ADG781/ADG782/ADG783
–7–
Test Circuits
Test Circuit 1. On Resistance
V
D
I
S
(OFF)
I
D
(OFF)
SD
V
S
A A
Test Circuit 2. Off Leakage
0.1F
V
S
IN
S
D
V
DD
GND
R
L
300
C
L
35pF
V
OUT
V
DD
ADG781
ADG782
V
IN
V
IN
V
OUT
t
ON
t
OFF
50% 50%
90%
90%
50% 50%
V
S
Test Circuit 4. Switching Times
S1 D1
0.1F
V
DD
IN1, IN2
V
S1
GND
R
L1
300
C
L1
35pF
V
OUT1
V
S2
V
OUT2
R
L2
300
C
L2
35pF
S2
V
IN
D2
V
DD
ADG783
t
D
t
D
50% 50%
90%
V
IN
V
OUT1
V
OUT2
90%
90%
90%
0V
0V
0V
Test Circuit 5. Break-Before-Make Time Delay, t
D
I
D
(ON)
SD
A
V
D
NC
NC = NO CONNECT
Test Circuit 3. On Leakage
V
OUT
V
OUT
Q
INJ
= C
L
V
OUT
SW ON
V
IN
SW OFF
S
D
V
DD
IN
R
S
GND
V
S
V
OUT
C
L
1nF
V
DD
Test Circuit 6. Charge Injection
V
S
V
OUT
50
NETWORK
ANALYZER
R
L
50
GND
S
D
V
S
OFF ISOLATION = 20 LOG
V
OUT
0.1F
V
DD
V
DD
50
V
IN
IN
Test Circuit 7. Off Isolation
CHANNEL-TO-CHANNEL
CROSSTALK = 20 LOG
V
OUT
V
S
GND
S1
D2
S2
NETWORK
ANALYZER
IN
D1
NC
V
OUT
R
L
50
0.1F
V
DD
V
DD
50
R
L
50
V
S
Test Circuit 8. Channel-to-Channel Crosstalk
C
I
DS
SD
V
S
V
R
ON
= V/I
DS
REV.
–8–
ADG781/ADG782/ADG783
V
S
V
OUT
50
NETWORK
ANALYZER
R
L
50
GND
S
D
0.1F
V
DD
V
DD
V
IN
IN
V
OUT
WITH SWITCH
V
OUT
WITHOUT SWITCH
INSERTION LOSS = 20 LOG
Test Circuit 9. Bandwidth
C
ADG781/ADG782/ADG783
REV. C –9–
OUTLINE DIMENSIONS
Figure 2. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-20-6)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADG781BCPZ −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADG781BCPZ-REEL7 −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADG782BCPZ −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADG782BCPZ-REEL7 −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADG783BCPZ −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADG783BCPZ-REEL −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
ADG783BCPZ-REEL7 −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-20-6
1
Z = RoHS Compliant Part.
REVISION HISTORY
2/13—Rev. B to Rev. C
Changed Pin 4 from S3 to S4 ........................................................... 4
Changes to Test Circuit 1 ................................................................. 7
Changes to Ordering Guide ............................................................. 9
8/12—Rev. A to Rev. B
Updated Outline Dimensions .......................................................... 9
Changes to Ordering Guide ............................................................. 9
3/02—Rev. 0 to Rev. A
Edits to Typical Performance Characteristics ........................... 5-6
Changes to OUTLINE DIMENSIONS drawing ........................... 8
0.50
BSC
0.65
0.60
0.55
0.30
0.25
0.18
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGD-1.
BOTTOM VIEWTOP VIEW
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.30
2.10 SQ
2.00
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5
08-16-2010-B
©2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D02372-0-2/13(C)
P1-P3P4-P6P7-P9

ADG783BCPZ-REEL7

Mfr. #:
Buy ADG783BCPZ-REEL7
Manufacturer:
Analog Devices Inc.
Description:
Analog Switch ICs IC 2.5 Ohm 5.5V CMOS Quad SPST
Lifecycle:
New from this manufacturer.
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