TYPICAL PROPERTIES
Color
Description Parameters
Pink
Material Chomerics T725
Thickness [inch (mm)]
Adhesive No
Thermal Impedance [°C-in²/W] (1) 0.06 @ 25 psi
Thermal Conductivity [W/m-K] (1) 0.07
Flame Rating V0
Continuous Temperature Range [°C] -55 to 125
Volume Resistivity [Ohm-cm] > 10^4
0.005 (0.127)
MOUNTING SURFACE PREPARATION
The mounting surface, usually the heat sink, should be clean and free from machining oils and aluminum dust, and may be cleaned with any common solvent, such as isopropyl alcohol (IPA) if
necessary. The surface of the heat sink may be anodized, chromate coated or unfinished aluminum.
When removing the pull-tab, use a quick, lifting motion. This is preferable over peeling the pull-tab from the HSP-7 pad and heat sink. To ensure optimal “wetting” of the HSP-7 pad to the heat
sink. It is recommended that the parts be allowed to dwell one hour prior to attempting release liner removal.
INSTALLATION OF HSP-7 PADS
HSP-7 material does not require pre-heating of the heat sink prior to installing the HSP-7 pad onto the heat sink, because of the phase change nature of the HSP-7 material, please follow the
process temperature/pressure guidelines below to ensure the best results for a specific assembly process:
Temperature/Pressure
Process Step Recommended Range
Removing pad from clear carrier liner
Installing pad onto “cold” heat sink
Installing pad onto “warm” heat sink
Removing protective blue release liner
Temp. of Roll: less than 38°C (100°F)
Heat Sink Temp: 16°C to 38°C (60°F to 100°F)
Roll Temp: 21°C to 38°C (70°F to 100°F)
Installation Pressure: 25 to 50 psi (2)
Heat Sink Temp: 24°C to 38°C (75°F to 100°F)
Roll Temp: 21°C to 38°C (70°F to 100°F)
Installation Pressure: 25 to 50 psi (2)
Temp of Heat Sink/Pad Assembly: Less than 38°C (100°F)
HSP-7
• Thermal Pad suitable for NOVA22 Panel Mount SSRs
• Easy to use thermal interface material
• Excellent alternative to thermal grease
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Copyright © 2015 Crydom Inc. Specifications subject to change without notice.
DataSheet
Accessories
