IXYS reserves the right to change limits, test conditions, and dimensions.
IXFH12N80P IXFQ12N80P
IXFV12N80P IXFV12N80PS
Symbol Test Conditions Characteristic Values
(T
J
= 25°C unless otherwise specified)
Min. Typ. Max.
g
fs
V
DS
= 20 V; I
D
= 0.5 I
D25
, Note 1 8 14 S
C
iss
2800 pF
C
oss
V
GS
= 0 V, V
DS
= 25 V, f = 1 MHz 210 pF
C
rss
19 pF
t
d(on)
23 ns
t
r
V
GS
= 10 V, V
DS
= 0.5 V
DSS
, I
D
= I
D25
26 ns
t
d(off)
R
G
= 5 Ω (External) 70 ns
t
f
25 ns
Q
g(on)
51 nC
Q
gs
V
GS
= 10 V, V
DS
= 0.5 V
DSS
, I
D
= 0.5 I
D25
13 nC
Q
gd
19 nC
R
thJC
0.35 °C/W
R
thCS
(TO-247 & TO-3P) 0.21 °C/W
Source-Drain Diode Characteristic Values
(T
J
= 25°C, unless otherwise specified)
Symbol Test Conditions Min. Typ. Max.
I
S
V
GS
= 0 V 12 A
I
SM
Repetitive 36 A
V
SD
I
F
= I
S
, V
GS
= 0 V, Note 1 1.5 V
t
rr
I
S
= 12 A, V
GS
= 0 V 200 250 ns
Q
rm
-di/dt = 100 A/μs, V
R
= 100 V 0.8 μC
I
rm
4 Α
Note 1: Pulse test, t ≤ 300 μs, duty cycle d ≤ 2 %
IXYS MOSFETs and IGBTs are covered by 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2
one or moreof the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537
Dim. Millimeter Inches
Min. Max. Min. Max.
A 4.7 5.3 .185 .209
A
1
2.2 2.54 .087 .102
A
2
2.2 2.6 .059 .098
b 1.0 1.4 .040 .055
b
1
1.65 2.13 .065 .084
b
2
2.87 3.12 .113 .123
C .4 .8 .016 .031
D 20.80 21.46 .819 .845
E 15.75 16.26 .610 .640
e 5.20 5.72 0.205 0.225
L 19.81 20.32 .780 .800
L1 4.50 .177
∅P 3.55 3.65 .140 .144
Q 5.89 6.40 0.232 0.252
R 4.32 5.49 .170 .216
S 6.15 BSC 242 BSC
e
∅ P
TO-247 (IXFH) Outline
1 2 3
Terminals: 1 - Gate 2 - Drain
3 - Source Tab - Drain
TO-3P (IXFQ) Outline