April 1996
1-283
© 1996 Actel Corporation
ACT
1 Series FPGAs
Features
5V and 3.3V Families fully compatible with JEDEC
specifications
Up to 2000 Gate Array Gates (6000 PLD equivalent gates)
Replaces up to 50 TTL Packages
Replaces up to twenty 20-Pin PAL
®
Packages
Design Library with over 250 Macro Functions
Gate Array Architecture Allows Completely Automatic
Place and Route
Up to 547 Programmable Logic Modules
Up to 273 Flip-Flops
Data Rates to 75 MHz
Two In-Circuit Diagnostic Probe Pins Support Speed
Analysis to 25 MHz
Built-In High Speed Clock Distribution Network
I/O Drive to 10 mA (5 V), 6 mA (3.3 V)
Nonvolatile, User Programmable
Fabricated in 1.0 micron CMOS technology
Description
The ACT™ 1 Series of field programmable gate arrays
(FPGAs) offers a variety of package, speed, and application
combinations. Devices are implemented in silicon gate,
1-micron two-level metal CMOS, and they employ Actel’s
PLICE
®
antifuse technology. The unique architecture offers
gate array flexibility, high performance, and instant
turnaround through user programming. Device utilization is
typically 95 to 100 percent of available logic modules.
ACT 1 devices also provide system designers with unique
on-chip diagnostic probe capabilities, allowing convenient
testing and debugging. Additional features include an on-chip
clock driver with a hardwired distribution network. The
network provides efficient clock distribution with minimum
skew.
The user-definable I/Os are capable of driving at both TTL
and CMOS drive levels. Available packages include plastic
and ceramic J-leaded chip carriers, ceramic and plastic quad
flatpacks, and ceramic pin grid array.
A security fuse may be programmed to disable all further
programming and to protect the design from being copied or
reverse engineered.
Product Family Profile
The Designer and Designer
Advantage™ Systems
The ACT 1 device family is supported by Actel’s Designer and
Designer Advantage Systems, allowing logic design
implementation with minimum effort. The systems offer
Microsoft
®
Windows
and X Windows
graphical user
interfaces and integrate with the resident CAE system to
provide a complete gate array design environment: schematic
capture, simulation, fully automatic place and route, timing
verification, and device programming. The systems also
include the ACTmap
VHDL optimization and synthesis tool
and the ACTgen
Macro Builder, a powerful macro function
generator for counters, adders, and other structural blocks.
Device
A1010B
A10V10B
A1020B
A10V20B
Capacity
Gate Array Equivalent Gates
PLD Equivalent Gates
TTL Equivalent Packages
20-Pin PAL Equivalent Packages
1,200
3,000
30
12
2,000
6,000
50
20
Logic Modules 295 547
Flip-Flops (maximum) 147 273
Routing Resources
Horizontal Tracks/Channel
Vertical Tracks/Column
PLICE Antifuse Elements
22
13
112,000
22
13
186,000
User I/Os (maximum) 57 69
Packages: 44 PLCC
68 PLCC
100 PQFP
80 VQFP
84 CPGA
44 PLCC
68 PLCC
84 PLCC
100 PQFP
80 VQFP
84 CPGA
84 CQFP
Performance
5 V Data Rate (maximum)
3.3 V Data Rate (maximum)
75 MHz
55 MHz
75 MHz
55 MHz
Note:
See Product Plan on page 1-286 for package availability.
1-284
The systems are available for 386/486/Pentium
PC and for
HP
and Sun
workstations and for running Viewlogic
®
,
Mentor Graphics
®
, Cadence
, OrCAD
, and Synopsys
design environments.
ACT 1 Device Structure
A partial view of an ACT 1 device (Figure 1) depicts four logic
modules and distributed horizontal and vertical interconnect
tracks. PLICE antifuses, located at intersections of the
horizontal and vertical tracks, connect logic module inputs
and outputs. During programming, these antifuses are
addressed and programmed to make the connections
required by the circuit application.
The ACT 1 Logic Module
The ACT 1 logic module is an 8-input, one-output logic circuit
chosen for the wide range of functions it implements and for
its efficient use of interconnect routing resources (Figure 2).
The logic module can implement the four basic logic
functions (NAND, AND, OR, and NOR) in gates of two, three,
or four inputs. Each function may have many versions, with
different combinations of active-low inputs. The logic module
can also implement a variety of D-latches, exclusivity
functions, AND-ORs, and OR-ANDs. No dedicated hardwired
latches or flip-flops are required in the array, since latches
and flip-flops may be constructed from logic modules
wherever needed in the application.
I/O Buffers
Each I/O pin is available as an input, output, three-state, or
bidirectional buffer. Input and output levels are compatible
with standard TTL and CMOS specifications. Outputs sink or
Figure 1
Partial View of an ACT 1 Device
Figure 2
ACT 1 Logic Module
1-285
ACT
1 Series FPGAs
source 10 mA at TTL levels. See Electrical Specifications for
additional I/O buffer specifications.
Device Organization
ACT 1 devices consist of a matrix of logic modules arranged in
rows separated by wiring channels. This array is surrounded
by a ring of peripheral circuits including I/O buffers,
testability circuits, and diagnostic probe circuits providing
real-time diagnostic capability. Between rows of logic
modules are routing channels containing sets of segmented
metal tracks with PLICE antifuses. Each channel has 22
signal tracks. Vertical routing is permitted via 13 vertical
tracks per logic module column. The resulting network allows
arbitrary and flexible interconnections between logic
modules and I/O modules.
Probe Pin
ACT 1 devices have two independent diagnostic probe pins.
These pins allow the user to observe any two internal signals
by entering the appropriate net name in the diagnostic
software. Signals may be viewed on a logic analyzer using
Actel’s Actionprobe
®
diagnostic tools. The probe pins can
also be used as user-defined I/Os when debugging is finished.
ACT 1 Array Performance
Temperature and Voltage Effects
Worst-case delays for ACT 1 arrays are calculated in the same
manner as for masked array products. A typical delay
parameter is multiplied by a derating factor to account for
temperature, voltage, and processing effects. However, in an
ACT 1 array, temperature and voltage effects are less
dramatic than with masked devices. The electrical
characteristics of module interconnections on ACT 1 devices
remain constant over voltage and temperature fluctuations.
As a result, the total derating factor from typical to
worst-case for a standard speed ACT 1 array is only 1.19 to 1,
compared to 2 to 1 for a masked gate array.
Logic Module Size
Logic module size also affects performance. A mask
programmed gate array cell with four transistors usually
implements only one logic level. In the more complex logic
module (similar to the complexity of a gate array macro) of
an ACT 1 array, implementation of multiple logic levels
within a single module is possible. This eliminates interlevel
wiring and associated RC delays. The effect is termed “net
compression.”
Ordering Information
Application (Temperature Range)
C = Commercial (0 to +70°C)
I = Industrial (–40 to +85°C)
M = Military (–55 to +125°C)
B = MIL-STD-883
Package Type
PL = Plastic J-Leaded Chip Carriers
PQ = Plastic Quad Flatpacks
CQ = Ceramic Quad Flatpack
PG = Ceramic Pin Grid Array
VQ = Very Thin Quad Flatpack
Speed Grade
Blank = Standard Speed
–1 = Approximately 15% faster than Standard
–2 = Approximately 25% faster than Standard
–3 = Approximately 35% faster than Standard
Part Number
A1010 = 1200 Gates (5 V)
A1020 = 2000 Gates (5 V)
A10V10 = 1200 Gates (3.3 V)
A10V20 = 2000 Gates (3.3 V)
Die Revision
B = 1.0 micron CMOS Process
Package Lead Count
A1010 B 2 PL 84 C

A1020B-PL68C

Mfr. #:
Manufacturer:
Microchip / Microsemi
Description:
IC FPGA 57 I/O 68PLCC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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