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CMS09(TE12L,Q,M)

P1-P3P4-P5
CMS09
2013-11-01
1
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CMS09
Switching Mode Power Supply Applications
Portable Equipment Battery Applications
• Forward voltage: V
FM
= 0.45 V (ｍax)
• Average forward current: I
F (AV)
= 1.0 A
• Repetitive peak reverse voltage: V
RRM
= 30 V
• Suitable for compact assembly due to small surface-mount package
“M−FLAT
TM
” (Toshiba package name)
Absolute Maximum Ratings
(Ta
=
25°C)
Characteristics Symbol Rating Unit
Repetitive peak reverse voltage V
RRM
30 V
Average forward current (Note 1) I
F (AV)
1.0
(Ta = 51°C)
A
Peak one cycle surge forward current
(non-repetitive)
I
FSM
25 (50 Hz) A
Junction temperature T
j
−40~150 °C
Storage temperature T
stg
−40~150 °C
Note 1: Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm, soldering land: 6 mm × 6 mm)
Note 2: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics
(Ta
=
25°C)
Characteristics Symbol Test Condition Min Typ. Max Unit
V
FM (1)
I
FM
= 0.1 A ⎯ 0.32 ⎯
V
FM (2)
I
FM
= 0.5 A ⎯ 0.37 ⎯
Peak forward voltage
V
FM (3)
I
FM
= 1.0 A ⎯ 0.40 0.45
V
I
RRM
V
RRM
= 5 V ⎯ 1.5 ⎯
Repetitive peak reverse current
I
RRM
V
RRM
= 30 V ⎯ 15.0 500
μA
Junction capacitance C
j
V
R
= 10 V, f = 1.0 MHz ⎯ 70 ⎯ pF
Device mounted on a ceramic board
(soldering land: 2 mm × 2 mm)
⎯ ⎯ 60
Thermal resistance R
th (j-a)
Device mounted on a glass-epoxy
board
(soldering land: 6 mm × 6 mm)
⎯ ⎯ 135
°C/W
Thermal resistance R
th (j-ℓ)
⎯ ⎯ ⎯ 16 °C/W
Unit: mm
JEDEC ―
JEITA ―
TOSHIBA 3-4E1A
Weight: 0.023 g (typ.)
Start of commercial production
2000-07
CMS09
2013-11-01
2
Marking
Abbreviation Code Part No.
S9 CMS09
Standard Soldering Pad
Handling Precaution
Schottky barrier diodes have reverse current characteristics compared to other diodes.
There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.
Please take forward and reverse loss into consideration during design.
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be
exceeded during operation, even for an instant. The following are the general derating methods that we recommend
when you design a circuit with a device.
V
RRM
: Use this rating with reference to the above. V
RRM
has a temperature coefficient of 0.1%/°C. Take
this temperature coefficient into account designing a device at low temperature.
I
F(AV)
: We recommend that the worst case current be no greater than 80% of the absolute maximum rating
of I
F(AV)
and T
j
be below 120°C. When using this device, take the margin into consideration by
using an allowable Tamax-I
F(AV)
curve.
I
FSM
: This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation,
which seldom occurs during the lifespan of the device.
T
j
: Derate this rating when using a device in order to ensure high reliability. We recommend that the
device be used at a T
j
of below 120°C.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When
using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
3.0 1.4
2.1
Unit: mm
1.4
CMS09
2013-11-01
3
0.5
0.001 0.01 0.1 1 10 100 1000
1
10
100
500
Device mounted on a glass-epoxy board
Soldering land: 2.1 mm × 1.4 mm
Device mounted on a glass-epoxy board
Soldering land: 6.0 mm × 6.0 mm
Device mounted on a ceramic board
Soldering land: 2.0 mm × 2.0 mm
Instantaneous forward voltage v
F
(V)
Instantaneous forward current i
F
(A)
Average forward current I
F (AV)
(A)
Average forward power dissipation
P
F (AV)
(W)
Average forward current I
F (AV)
(A)
Maximum allowable ambient temperature
Ta max ( ° C )
Average forward current I
F (AV)
(A)
Maximum allowable ambient temperature
Ta max ( ° C )
i
F
– v
F
P
F (AV)
– I
F (AV)
Ta m a x – I
F (AV)
Device mounted on a glass-epoxy board
(
board size: 50 mm × 50 mm, land size 6 mm × 6 mm
)
Ta m a x – I
F (AV)
Device mounted on a ceramic board
(
board size: 50 mm × 50 mm
)
0.1
1
10
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
75°C
125°C
25°C
T
j
= 150°C
0.9
0
0
40
160
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
DC
20
60
80
100
120
α = 180°
α = 120°
α = 60°
360° 0° α
Rectangular
waveform
Conduction angle: α
I
F (AV)
V
R
= 15 V
140
0
0
40
160
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
DC
20
60
80
100
120
α = 180°
α = 120°
α = 60°
360°0° α
Rectangular
waveform
Conduction angle: α
I
F (AV)
V
R
= 15 V
140
0
0
0.2
0.6
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
DC
0.1
0.3
0.4
α = 180°
α = 120°
α = 60°
0.5
360°0° α
Rectangular
waveform
Conduction angle: α
Transient thermal impedance r
th (j-a)
(°C/W)
Time t (s)
r
th (j-a)
– t
P1-P3P4-P5

CMS09(TE12L,Q,M)

Mfr. #:
Buy CMS09(TE12L,Q,M)
Manufacturer:
Toshiba
Description:
Schottky Diodes & Rectifiers 30V 1A M-FLAT
Lifecycle:
New from this manufacturer.
Delivery:
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