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VNQ05XSP16-E

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17
13/17
VNQ05XSP16
PowerSO-16™ PC Board
R
thj-amb
Vs PCB copper area in open box free air condition
PowerSO-16™ THERMAL DATA
Layout condition of R
th
and Z
th
measurements (PCB FR4 area= 60mm x 60mm, PCB thickness=2mm,
Cu thickness=35µm, Copper areas: 6cm
2
).
30
35
40
45
50
55
0246810
PCB Cu heatsink area (cm^2)
RTHj_amb (°C/W)
Tj-Tamb=50°C
1
Obsolete Product(s) - Obsolete Product(s)
14/17
VNQ05XSP16
Thermal fitting model of a quad HSD in
PowerSO-16
Pulse calculation formula
Thermal Parameter
Area/island (cm
2
) Footprint 6
R1 (°C/W) 0.18
R2 (°C/W) 0.8
R3 ( °C/W) 0.7
R4 (°C/W) 0.8
R5 (°C/W) 13
R6 (°C/W) 37 22
C1 (W.s/°C) 0.0006
C2 (W.s/°C) 1.50E-03
C3 (W.s/°C) 1.75E-02
C4 (W.s/°C) 0.4
C5 (W.s/°C) 0.75
C6 (W.s/°C) 3 5
Z
THδ
R
TH
δ Z
THtp
1 δ–()+⋅=
where
δ t
p
T⁄=
Thermal Impedance Junction Ambient Single Pulse
0.1
1
10
100
1000
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
ZTH (°C/W)
Pd1
C1
R4
C3 C4
R3R1 R6R5R2
C5 C6C2
Pd2
R14
C13 C1 4
R13
Tj_1
Tj_2
T_amb
Pd3
C7
R10
C9 C10
R9R7
R12R11
R8
C1 1 C1 2C8
Pd4
R16
C15 C16
R15
Tj_3
Tj_4
R17
R18
Footprint
6 cm
2
1
Obsolete Product(s) - Obsolete Product(s)
15/17
VNQ05XSP16
DIM.
mm.
MIN. TYP MAX.
A1 0 0.05 0.1
A2 3.4 3.5 3.6
A3 1.2 1.3 1.4
A4 0.15 0.2 0.25
a0.2
b 0.27 0.35 0.43
c 0.23 0.27 0.32
D 9.4 9.5 9.6
D1 7.4 7.5 7.6
d 0 0.05 0.1
E (1) 13.85 14.1 14.35
E1 9.3 9.4 9.5
E2 7.3 7.4 7.5
E3 5.9 6.1 6.3
e0.8
e1 5.6
F0.5
G1.2
L 0.8 1 1.1
R1 0.25
R2 0.8
T 2° 5° 8°
T1 6° (typ.)
T2 10° (typ.)
Package Weight (typ.)
P013Q
POWERSO-16
TM
MECHANICAL DATA
Obsolete Product(s) - Obsolete Product(s)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17

VNQ05XSP16-E

Mfr. #:
Buy VNQ05XSP16-E
Manufacturer:
STMicroelectronics
Description:
IC SSR HI SIDE QUAD 36V PWRSO16
Lifecycle:
New from this manufacturer.
Delivery:
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