Si595
6 Rev. 1.4
Table 8. Environmental Compliance and Package Information
Parameter Conditions/Test Method
Mechanical Shock MIL-STD-883, Method 2002
Mechanical Vibration MIL-STD-883, Method 2007
Solderability MIL-STD-883, Method 2003
Gross and Fine Leak MIL-STD-883, Method 1014
Resistance to Solder Heat MIL-STD-883, Method 2036
Contact Pads Gold over Nickel
Table 9. Thermal Characteristics
(Typical values TA = 25 ºC, V
DD
=3.3V)
Parameter Symbol Test Condition Min Typ Max Unit
5x7mm, Thermal Resistance Junction to
Ambient
JA
Still Air — 84.6 — °C/W
5x7mm, Thermal Resistance Junction to
Case
JC
Still Air — 38.8 — °C/W
3.2x5mm, Thermal Resistance Junction to
Ambient
JA
Still Air — 31.1 — °C/W
3.2x5mm, Thermal Resistance Junction to
Case
JC
Still Air — 13.3 — °C/W
Ambient Temperature T
A
–40 — 85 °C
Junction Temperature T
J
——125°C
Table 10. Absolute Maximum Ratings
1
Parameter Symbol Rating Units
Maximum Operating Temperature T
AMAX
85 ºC
Supply Voltage V
DD
–0.5 to +3.8 V
Input Voltage V
I
–0.5 to V
DD
+ 0.3
Storage Temperature T
S
–55 to +125 ºC
ESD Sensitivity (HBM, per JESD22-A114) ESD 2500 V
Soldering Temperature (Pb-free profile)
2
T
PEAK
260 ºC