©2010 Littelfuse, Inc.
Gas Discharge Tube (GDT) Products
50
Revised: June 28, 2010
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
SL1011A/B and SL1411A Series
SL1011A/B and SL1411A Series
Reflow Condition Pb-free assembly
Pre Heat
- Temperature Min (T
s(min)
) 150°C
- Temperature Max (T
s(max)
) 200°C
- Time (Min to Max) (t
s
) 60 – 180 seconds
Average Ramp-up Rate (Liquidus Temp
(T
L
) to peak)
3°C/second max.
T
S(max)
to T
L
- Ramp-up Rate 5°C/second max.
Reflow
- Temperature (T
L
) (Liquidus) 217°C
- Temperature (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 260
+0/-5
°C
Time within 5°C of Actual Peak
Temperature (t
p
)
10 – 30 seconds
Ramp-down Rate 6°C/second max.
Time 25°C to Peak Temperature (T
P
) 8 minutes max.
Do not exceed 260°C
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Time
Temperature
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
(t 25ºC to peak)
Ramp-down
Ramp-up
Preheat
Critical Zone
T
L
to T
P
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
Soldering Parameters - Hand Soldering
Dwell Time
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
220
230
240
Time (Seconds)
Temperature (°C) - Measured on bottom side of board
Cooling Time
Preheat Time
Wave Parameter Lead-Free Recommendation
Preheat:
(Depends on Flux Activation Temperature)
(Typical Industry Recommendation)
Temperature Minimum:
100
° C
Temperature Maximum:
150
° C
Preheat Time: 60-180 seconds
Solder Pot Temperature:
280
° C Maximum
Solder Dwell Time: 2-5 seconds
Recommended Process Parameters:
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
