Data Sheet ADG1204
Rev. C | Page 15 of 16
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
061908-A
8°
0°
4.50
4.40
4.30
14
8
7
1
6.40
BSC
PIN 1
5.10
5.00
4.90
0.65 BSC
0.15
0.05
0.30
0.19
1.20
MAX
1.05
1.00
0.80
0.20
0.09
0.75
0.60
0.45
COPLANARITY
0.10
SEATING
PLANE
Figure 32. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
1.45
1.30 SQ
1.15
111808-A
1
0.50
BSC
BOTTOM VIEWTOP VIEW
12
4
6
7
9
10
3
EXPOSED
PAD
PIN 1
INDICATOR
3.10
3.00 SQ
2.90
0.70
0.60
0.50
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
0.30
0.23
0.18
COMPLIANT
TO
JEDEC STANDARDS MO-220-WEED.
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.80
0.75
0.70
Figure 33. 12-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-12-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADG1204YRUZ −40°C to +125°C 14-Lead Thin Shrink Small Outline Package [TSSOP] RU-14
ADG1204YRUZ-REEL −40°C to +125°C 14-Lead Thin Shrink Small Outline Package [TSSOP] RU-14
ADG1204YRUZ-REEL7 −40°C to +125°C 14-Lead Thin Shrink Small Outline Package [TSSOP] RU-14
ADG1204YCPZ-500RL7 −40°C to +125°C 12-Lead Lead Frame Chip Scale Package [LFCSP] CP-12-4
ADG1204YCPZ-REEL7 −40°C to +125°C 12-Lead Lead Frame Chip Scale Package [LFCSP] CP-12-4
1
Z = RoHS Compliant Part.
