MAX5893
For stable operation with the internal reference, REFIO
should be decoupled to GND with a 1µF capacitor.
REFIO must be buffered with an external amplifier, if
heavy loading is required, due to its 10k output resis-
tance.
Alternatively, apply a temperature-stable external refer-
ence to REFIO (Figure 18). The internal reference is over-
driven by the external reference. For improved accuracy
and drift performance, choose a fixed output voltage ref-
erence such as the MAX6520 bandgap reference.
The MAX5893’s reference circuit (Figure 19) employs a
control amplifier, designed to regulate the full-scale
current I
OUT
for the differential current outputs of the
DAC. The output current can be calculated as:
I
OUTFS
= 32 x I
REFIO
- 1LSB
I
OUTFS
= 32 x I
REFIO
- (I
OUT
/2
12
)
where I
REFIO
is the reference output current (I
REFIO
=
V
REFIO
/R
SET
) and I
OUT
is the full-scale output current
of the DAC. Located between FSADJ and DACREF,
R
SET
is the reference resistor, which determines the
amplifier’s output current for the DAC. Use Table 5 for a
matrix of different I
OUTFS
and R
SET
selections.
12-Bit, 500Msps Interpolating and Modulating
Dual DAC with CMOS Inputs
28 ______________________________________________________________________________________
Figure 18. Typical External Reference Circuit
1.2V
REFERENCE
CURRENT-
SOURCE
ARRAY DAC
REFIO
EXTERNAL
1.25V
REFERENCE
R
SET
FSADJ
I
REF
10k
DACREF
1µF
MAX5893
1.2V
REFERENCE
CURRENT-
SOURCE
ARRAY DAC
REFIO
FSADJ
I
REF
10k
DACREF
1µF
MAX5893
R
SET
FULL-SCALE
CURRENT
REFERENCE
CURRENT
R
SET
() OUTPUT VOLTAGE
I
OUTFS
(mA) I
REF
(µA) CALCULATED 1% EIA STD V
IOUTP/N
* (mV
P-P
)
2 62.50 19.2k 19.1k 100
5 156.26 7.68k 7.5k 250
10 312.50 3.84k 3.83k 500
15 468.75 2.56k 2.55k 750
20 625.00 1.92k 1.91k 1000
Figure 19. MAX5893 Internal Reference Architecture
Table 5. I
OUTFS
and R
SET
Selection Matrix Based on a Typical 1.20V Reference Voltage
*
Terminated into a 50
load.
MAX5893
12-Bit, 500Msps Interpolating and Modulating
Dual DAC with CMOS Inputs
______________________________________________________________________________________ 29
Power Supplies, Bypassing,
Decoupling, and Layout
Grounding and power-supply decoupling strongly influ-
ence the MAX5893 performance. Unwanted digital
crosstalk can couple through the input, reference,
power-supply, and ground connections, which can
affect dynamic specifications like signal-to-noise ratio
or spurious-free dynamic range. In addition, electro-
magnetic interference (EMI) can either couple into or
be generated by the MAX5893. Observe the grounding
and power-supply decoupling guidelines for high-
speed, high-frequency applications. Follow the power-
supply and filter configuration guidelines to achieve
optimum dynamic performance.
Using a multilayer PCB with separate ground and
power-supply planes, run high-speed signals on lines
directly above the ground plane. Since the MAX5893
has separate analog and digital sections, the PCB
should include separate analog and digital ground sec-
tions with only one point connecting the three planes at
the exposed pad under the MAX5893. Run digital sig-
nals above the digital ground plane and analog/clock
signals above the analog/clock ground plane. Keep
digital signals as far away from sensitive analog inputs,
reference lines, and clock inputs as practical. Use a
symmetric design of clock input and the analog output
lines to minimize 2nd-order harmonic distortion compo-
nents, thus optimizing the dynamic performance of the
DAC. Keep digital signal paths short and run lengths
matched to avoid propagation delay and data skew
mismatches.
The MAX5893 requires five separate power-supply
inputs for the analog (AV
DD1.8
and AV
DD3.3
), digital
(DV
DD1.8
and DV
DD3.3
), and clock (AV
CLK
) circuitry.
Decouple each voltage supply pin with a separate
0.1µF capacitor as close to the device as possible and
with the shortest possible connection to the appropriate
ground plane. Minimize the analog and digital load
capacitances for optimized operation. Decouple all
power-supply voltages at the point they enter the PCB
with tantalum or electrolytic capacitors. Ferrite beads
with additional decoupling capacitors forming a pi-net-
work could also improve performance.
The exposed pad (EP) MUST be soldered to the
ground. Use multiple vias, an array of at least 4 x 4
vias, directly under the EP to provide a low thermal and
electrical impedance path for the IC.
Static Performance Parameter
Definitions
Integral Nonlinearity (INL)
Integral nonlinearity is the deviation of the values on an
actual transfer function from either a best straight-line fit
(closest approximation to the actual transfer curve) or a
line drawn between the end points of the transfer func-
tion, once offset and gain errors have been nullified.
For a DAC, the deviations are measured at every indi-
vidual step.
Differential Nonlinearity (DNL)
Differential nonlinearity is the difference between an
actual step height and the ideal value of 1 LSB. A DNL
error specification of less than 1 LSB guarantees no
missing codes and a monotonic transfer function.
Offset Error
The offset error is the difference between the ideal and
the actual offset current. For a DAC, the offset point is
the average value at the output for the two midscale
digital input codes with respect to the full-scale of the
DAC. This error affects all codes by the same amount.
Gain Error
A gain error is the difference between the ideal and the
actual full-scale output voltage on the transfer curve,
after nullifying the offset error. This error alters the slope
of the transfer function and corresponds to the same
percentage error in each step.
Dynamic Performance
Parameter Definitions
Settling Time
The settling time is the amount of time required from the
start of a transition until the DAC output settles its new
output value to within the specified accuracy.
Noise Spectral Density
The DAC output noise is the sum of the quantization
noise and thermal noise. Noise spectral density is the
noise power in 1Hz bandwidth, specified in dBFS/Hz.
Signal-to-Noise Ratio (SNR)
For a waveform perfectly reconstructed from digital
samples, the theoretical maximum SNR is the ratio of
the full-scale analog output (RMS value) to the RMS
quantization error (residual error). The ideal, theoretical
maximum SNR can be derived from the DAC’s resolu-
tion (N bits):
SNR
dB
= 6.02
dB
x N + 1.76
dB
MAX5893
However, noise sources such as thermal noise, refer-
ence noise, clock jitter, etc. affect the ideal reading.
Therefore, SNR is computed by taking the ratio of the
RMS signal to the RMS noise, which includes all spec-
tral components minus the fundamental, the first four
harmonics, and the DC offset.
Spurious-Free Dynamic Range (SFDR)
SFDR is the ratio of the RMS amplitude of the carrier
frequency (maximum signal components) to the RMS
value of their next largest distortion component. SFDR
is usually measured in dBc and with respect to the car-
rier frequency amplitude or in dBFS with respect to the
DAC’s full-scale range. Depending on its test condition,
SFDR is observed within a predefined window or
to Nyquist.
Two-/Four-Tone Intermodulation
Distortion (IMD)
The two-tone IMD is the ratio expressed in dBc (or
dBFS) of the worst 3rd-order (or higher) IMD products
to either output tone.
Adjacent Channel Leakage
Power Ratio (ACLR)
Commonly used in combination with WCDMA (wide-
band code-division multiple-access), ACLR reflects the
leakage power ratio in dB between the measured pow-
ers within a channel relative to its adjacent channel.
ACLR provides a quantifiable method of determining
out-of-band spectral energy and its influence on an
adjacent channel when a bandwidth-limited RF signal
passes through a nonlinear device.
12-Bit, 500Msps Interpolating and Modulating
Dual DAC with CMOS Inputs
30 ______________________________________________________________________________________

MAX5893EGK+TD

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Digital to Analog Converters - DAC 12-Bit 2Ch 500Msps DAC
Lifecycle:
New from this manufacturer.
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