Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
1. Flux and Solder
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol (IPA))
(2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the
mounted products and P.C.B.
Power : 20W / l max.
Frequency : 28kHz to 40kHz
Time : 5 minutes max.
(3) Cleaner 1. Cleaner
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to
remove the cleaner.
(5) Other cleaning
Please contact us.
3. Standard Land Dimensions
The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.
< Standard land dimensions for reflow >
･Side on which chips are mounted
4.Storage and Delivery condition (in mm)
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
・Products should be stored in the warehouse on the following conditions.
Temperature: -10 to +40°C
Humidity: 15 to 85% relative humidity
No rapid change on temperature and humidity
・Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause
oxidization of electrode, resulting in poor solderability.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
・Products should be stored under the airtight packaged condition.
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be
arranged according to the figure to reinforce the ground-pattern.
Small diameter thru hole
f
0.4
Resist
Copper foil pattern
No pattern
0.6
1.4
2.6
0.8
2.3
0.6
1.9
Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%).
Do not use water-soluble flux.
Other flux (except above) Please contact us for details, then use.
Use Sn-3.0Ag-0.5Cu solder
Use of Sn-Zn based solder will deteriorate performance of products.
In case of using Sn-Zn based solder, please contact Murata in advance.
