DVRN6056
Document number: DS30556 Rev. 5 - 2
1 of 5
www.diodes.com
March 2010
© Diodes Incorporated
DVRN6056
VOLTAGE REFERENCE ARRAY
Features
• Epitaxial Planar Die Construction
• Ideally Suited for Automated Assembly Processes
• Lead Free/RoHS Compliant Version (Notes 2 & 3)
• “Green” Device (Note 3)
Mechanical Data
• Case: SOT-26
• Case Material: Molded Plastic, “Green” Molding Compound
(Note 3) UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminal Connections: See Diagram
• Terminals: Matte Tin Finish annealed over Copper leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
• Marking Information: See Page 4
• Ordering Information: See Page 4
• Weight: 0.008 grams (approximate)
Maximum Ratings, NPN Transistor Element (Q1) @T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Collector-Base Voltage
V
CBO
60 V
Collector-Emitter Voltage
V
CEO
40 V
Emitter-Base Voltage
V
EBO
6.0 V
Collector Current - Continuous (Note 1)
I
C
600 mA
Maximum Ratings, Zener Element (Z1) @T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Forward Voltage @ I
F
= 10mA V
F
0.9 V
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1)
P
D
300 mW
Thermal Resistance, Junction to Ambient (Note 1)
R
JA
417
°C/W
Operating and Storage Temperature Range
T
J
, T
STG
-55 to +150
°C
Notes: 1. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Product manufactured with date code WN (Week 45, 2009) and newer are built with Green Molding Compound and Lead-free plating. Product
manufactured prior to date code WO are built with Tin-Lead plating, Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
Top View
Device Schematic
A
1
E
1
K
1
NC
C
1
B
1
Q1
Z1