NCP571, NCV571
http://onsemi.com
2
TSOP−5 package
1
3
NC
V
in
2
GND
Enable
4
V
out
5
(Top View)
DFN6 package
1
3
Enable
V
out
2
NC
GND
4
V
in
6
(Top View)
EP
5
NC
PIN CONNECTIONS
PIN FUNCTION DESCRIPTION
DFN6 TSOP−5 Pin Name Description
1 5 V
out
Regulated output voltage.
2 4 NC No Internal Connection. It is recommended to connect this pin to GND potential.
3 2 GND Power supply ground.
4 3 Enable This input is used to place the device into low−power standby. When this input is
pulled low, the device is disabled. If this function is not used, Enable pin should be
connected to V
in
.
5 − NC No Internal Connection. It is recommended to connect this pin to GND potential.
6 1 V
in
Positive power supply input voltage.
EP − EP No Internal Connection. It is recommended to connect this pin to GND potential.
MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage V
in
0 to 12 V
Enable Voltage V
EN
−0.3 to V
in
+ 0.3 V
Output Voltage V
out
−0.3 to V
in
+ 0.3 V
Power Dissipation P
D
Internally Limited W
Operating Junction Temperature T
J
+150 °C
Operating Ambient Temperature NCP571
NCV571
T
A
−40 to +85
−40 to +125
°C
Storage Temperature T
stg
−55 to +150 °C
ESD Capability, Human Body Model (Note 1) ESD
HBM
2000 V
ESD Capability, Machine Mode (Note 1) ESD
MM
200 V
ESD Capability, Charged Device Model (Note 1) ESD
CDM
1000 V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series contains ESD protection and exceeds the following tests:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model (Jedec Standard)
2. Latchup capability (85°C) $100 mA DC with trigger voltage.
THERMAL CHARACTERISTICS
Rating Symbol Test Conditions Typical Value Unit
Junction−to−Ambient TSOP−5
R
q
JA
1 oz Copper Thickness, 100 mm
2
250 °C/W
PSIJ−Lead 2 TSOP−5
Y
J−L2
1 oz Copper Thickness, 100 mm
2
68 °C/W
Junction−to−Ambient DFN6
R
q
JA
1 oz Copper Thickness, 100 mm
2
190 °C/W
PSIJ−Lead 2 DFN6
Y
J−L2
1 oz Copper Thickness, 100 mm
2
84 °C/W
NOTE: Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the following
boundary conditions as stated in EIA/JESD 51−1, 2, 3, 7, 12.