ADF4106-EP Enhanced Product
OUTLINE DIMENSIONS
16
9
81
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 17. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
3.75
BCS SQ
COMPLIANT
TO
JEDEC STANDARDS MO-220-VGGD-1
1
0.50
BSC
PIN 1
INDICATOR
0.75
0.60
0.50
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDICATOR
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
2.25
2.10 SQ
1.95
20
6
16
10
11
15
5
0.60 MAX
0.60 MAX
0.25 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
04-09-2012-B
BOTTOM VIEW
EXPOSED
PAD
4.10
4.00 SQ
3.90
Figure 18. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-20-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADF4106SRU-EP −55°C to + 125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4106SRU-EP-R7 −55°C to + 125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADF4106SCPZ-EP −55°C to + 125°C 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-20-1
ADF4106SCPZ-EP-R7 −55°C to + 125°C 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-20-1
1
Z = RoHS Compliant Part.
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D09272-0-11/14(C)
Rev. C | Page 10 of 10
