ADF4106-EP Enhanced Product
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
R
SET
CP
CPGND
AGND
1
2
3
4
5
6
7
8
RF
IN
B
RF
IN
A
AV
DD
REF
IN
MUXOUT
LE
DATA
CLK
CE
DGND
16
15
14
13
12
11
10
9
V
P
DV
DD
TOP VIEW
(Not to Scale)
ADF4106-EP
NOTES:
1. TRANSISTOR COUNT 6425 (CMOS),
303 (BIPOLAR).
09272-003
F
igure 3. 16-Lead TSSOP Pin Configuration
15 MUXOUT
14 LE
13 DATA
12 CLK
CPGND 1
AGND 2
AGND 3
20 CP
11 CE
6
7
8
DGND 9
DGND 10
19
18
17
16
RF
IN
B 4
RF
IN
A 5
R
SET
V
P
DV
DD
DV
DD
PIN 1
INDICATOR
TOP VIEW
(Not to Scale)
ADF4106-EP
AV
DD
AV
DD
REF
IN
NOTES
1. TRANSISTOR COUNT 6425 (CMOS),
303 (BIPOLAR).
2. THE EXPOSED PAD MUST BE
CONNECTED TO AGND.
09272-004
Figure 4. 20-Lead LFCSP Pin Configuration
T
able 4. Pin Function Descriptions
Pin No.
TSSOP
Pin No.
LFCSP Mnemonic Description
1 19 R
SET
Connecting a resistor between this pin and CPGND sets the maximum charge pump output current. The
nominal voltage potential at the R
SET
pin is 0.66 V. The relationship between I
CP
and R
SET
is
So, with R
SET
= 5.1 kΩ, I
CP MAX
= 5 mA.
2 20 CP Charge Pump Output. When enabled, this provides ±I
CP
to the external loop filter, which in turn drives
the external VCO.
3 1 CPGND Charge Pump Ground. This is the ground return path for the charge pump.
4 2, 3 AGND Analog Ground. This is the ground return path of the prescaler.
5 4 RF
IN
B Complementary Input to the RF Prescaler. This point must be decoupled to the ground plane with a
small bypass capacitor, typically 100 pF.
6 5 RF
IN
A Input to the RF Prescaler. This small signal input is ac-coupled to the external VCO.
7 6, 7 AV
DD
Analog Power Supply. This can range from 2.7 V to 3.3 V. Decoupling capacitors to the analog ground
plane should be placed as close as possible to this pin. AV
DD
must be the same value as DV
DD
.
8 8 REF
IN
Reference Input. This is a CMOS input with a nominal threshold of V
DD
/2 and a dc equivalent input
resistance of 100 kΩ. This input can be driven from a TTL or CMOS crystal oscillator or it can be ac-coupled.
9 9, 10 DGND Digital Ground.
10 11 CE Chip Enable. A logic low on this pin powers down the device and puts the charge pump output into
three-state mode. Taking the pin high powers up the device, depending on the status of the power-
down bit, F2.
11 12 CLK Serial Clock Input. This serial clock is used to clock in the serial data to the registers. The data is latched
into the 24-bit shift register on the CLK rising edge. This input is a high impedance CMOS input.
12 13 DATA Serial Data Input. The serial data is loaded MSB first with the two LSBs being the control bits. This input
is a high impedance CMOS input.
13 14 LE Load Enable, CMOS Input. When LE goes high, the data stored in the shift registers is loaded into one of
the four latches with the latch being selected using the control bits.
14 15 MUXOUT
This multiplexer output allows either the lock detect, the scaled RF, or the scaled reference frequency to
be accessed externally.
15 16, 17 DV
DD
Digital Power Supply. This can range from 2.7 V to 3.3 V. Decoupling capacitors to the digital ground
plane should be placed as close as possible to this pin. DV
DD
must be the same value as AV
DD
.
16 18 V
P
Charge Pump Power Supply. This should be greater than or equal to V
DD
. In systems where V
DD
is 3 V, it
can be set to 5.5 V and used to drive a VCO with a tuning range of up to 5 V.
EP Exposed Pad. The exposed pad must be connected to AGND.
Rev. C | Page 6 of 10