SI4204DY-T1-GE3

Vishay Siliconix
Si4204DY
Document Number: 65154
S10-1042-Rev. A, 03-May-10
www.vishay.com
1
Dual N-Channel 20 V MOSFET
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)I
D
(A) Q
g
(Typ.)
20
0.0046 at V
GS
= 10 V 19.8
a
14.5
0.006 at V
GS
= 4.5 V 17.3
a
S
1
D
1
G
1
D
1
S
2
D
2
G
2
D
2
SO-8
5
6
7
8
Top View
2
3
4
1
Ordering Information: Si4204DY-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET
G
1
D
1
S
1
N-Channel MOSFET
G
2
D
2
S
2
Notes:
a. Based on T
C
= 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under steady state conditions is 120 °C/W.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage V
DS
20
V
Gate-Source Voltage V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
19.8
A
T
C
= 70 °C 15.9
T
A
= 25 °C 15.5
b, c
T
A
= 70 °C 12.2
b, c
Pulsed Drain Current (10 µs Pulse Width) I
DM
50
Source-Drain Current Diode Current
T
C
= 25 °C
I
S
2.7
T
A
= 25 °C 1.6
b, c
Pulsed Source-Drain Current I
SM
50
Single Pulse Avalanche Current
L = 0.1 mH
I
AS
20
Single Pulse Avalanche Energy E
AS
20
Maximum Power Dissipation
T
C
= 25 °C
P
D
3.25
W
T
C
= 70 °C 2.10
T
A
= 25 °C 2.0
b, c
T
A
= 70 °C 1.25
b, c
Operating Junction and Storage Temperature Range T
J
, T
stg
- 55 to 150 °C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typ. Max. Unit
Maximum Junction-to-Ambient
b, d
t 10 s
R
thJA
45 62.5
°C/W
Maximum Junction-to-Foot (Drain) Steady-State R
thJF
29 38
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
TrenchFET
®
Power MOSFET
100 % R
g
Tested
100 % UIS Tested
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
DC/DC Converter
Fixed Telecom
Notebook PC
www.vishay.com
2
Document Number: 65154
S10-1042-Rev. A, 03-May-10
Vishay Siliconix
Si4204DY
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0 V, I
D
= 250 µA 20 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= 250 µA 20
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
I
D
= 250 µA - 5.8
Gate Threshold Voltage V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA 1.0 2.4 V
Gate-Body Leakage I
GSS
V
DS
= 0 V, V
GS
= ± 20 V 100 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= 20 V, V
GS
= 0 V 1
µA
V
DS
= 20 V, V
GS
= 0 V, T
J
= 55 °C 10
On-State Drain Current
b
I
D(on)
V
DS
= 5 V, V
GS
= 10 V 20 A
Drain-Source On-State Resistance
b
R
DS(on)
V
GS
= 10 V, I
D
= 10 A 0.0038 0.0046
Ω
V
GS
= 4.5 V, I
D
= 8 A 0.0047 0.0060
Forward Transconductance
b
g
fs
V
DS
= 15 V, I
D
= 10 A 50 S
Dynamic
a
Input Capacitance C
iss
V
DS
= 10 V, V
GS
= 0 V, I
D
= 1 MHz
2110
pFOutput Capacitance C
oss
926
Reverse Transfer Capacitance C
rss
235
Total Gate Charge Q
g
V
DS
= 10 V, V
GS
= 10 V, I
D
= 10 A 30 45
nC
V
DS
= 10 V, V
GS
= 4.5 V, I
D
= 10 A
14.5 22
Gate-Source Charge Q
gs
4.5
Gate-Drain Charge Q
gd
3.9
Gate Resistance R
g
f = 1 MHz 0.4 1.4 2.8 Ω
Tur n - O n D e l ay Time t
d(on)
V
DD
= 10 V, R
L
= 1 Ω
I
D
10 A, V
GEN
= 10 V, R
g
= 1 Ω
816
ns
Rise Time t
r
15 30
Turn-Off Delay Time t
d(off)
24 45
Fall Time t
f
918
Tur n - O n D e l ay Time t
d(on)
V
DD
= 10 V, R
L
= 1 Ω
I
D
10 A, V
GEN
= 4.5 V, R
g
= 1 Ω
18 35
Rise Time t
r
24 45
Turn-Off Delay Time t
d(off)
26 50
Fall Time t
f
13 26
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
S
T
C
= 25 °C 2.7
A
Pulse Diode Forward Current
a
I
SM
50
Body Diode Voltage V
SD
I
S
= 3 A 0.70 1.2 V
Body Diode Reverse Recovery Time t
rr
N-Channel
I
F
= 10 A, dI/dt = 100 A/µs, T
J
= 25 °C
20 40 ns
Body Diode Reverse Recovery Charge Q
rr
10 20 nC
Reverse Recovery Fall Time t
a
11
nS
Reverse Recovery Rise Time t
b
9
Document Number: 65154
S10-1042-Rev. A, 03-May-10
www.vishay.com
3
Vishay Siliconix
Si4204DY
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
On-Resistance vs. Drain Current and Gate Voltage
Gate Charge
0
10
20
30
40
50
0.0 0.5 1.0 1.5 2.0 2.5
V
GS
=10V thru 3 V
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
V
GS
=2 V
0.0030
0.0036
0.0042
0.0048
0.0054
0.0060
0 1020304050
V
GS
=4.5V
V
GS
=10V
- On-Resistance (Ω)R
DS(on)
I
D
- Drain Current (A)
0
2
4
6
8
10
0 7 14 21 28 35
V
DS
=10V
V
DS
=5 V
I
D
=10A
V
DS
= 15 V
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0
2
4
6
8
10
012345
T
C
= 25 °C
T
C
= 125 °C
T
C
= - 55 °C
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
C
rss
0
500
1000
1500
2000
2500
0 5 10 15 20
C
iss
C
oss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
0.6
0.8
1.0
1.2
1.4
1.6
1.8
- 50 - 25 0 25 50 75 100 125 150
I
D
=10A
V
GS
=4.5V
V
GS
=10V
T
J
-Junction Temperature (°C)
(Normalized)
- On-ResistanceR
DS(on)

SI4204DY-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 20V Vds 20V Vgs SO-8
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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