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TSL260RD-TR

P1-P3P4-P6P7-P9P10-P12
TSL250RD, TSL251RD, TSL260RD, TSL261RD
LIGHT-TO-VOLTAGE OPTICAL SENSORS
TAOS050K ï OCTOBER 2007
7
The LUMENOLOGY r Company
r
r
Copyright E 2007, TAOS Inc.
www.taosinc.com
MECHANICAL DATA
This SOIC package consists of an integrated circuit mounted on a lead frame and encapsulated with an electrically
nonconductive clear plastic compound. The photodiode area is typically 1.02 mm
2
for the TSL250RD and TSL260RD,
and is typically 0.514 mm
2
for the TSL251RD and TSL261RD.
PACKAGE D PLASTIC SMALL-OUTLINE
A
1.75
1.35
0.50
0.25
4.00
3.80
6.20
5.80
45
0.88 TYP TOP OF
SENSOR DIE
5.00
4.80
5.3
MAX
1.27
0.41
0.25
0.10
0.25
0.19
DETAIL A
PIN 1
6 1.27
0.510
0.330
8
2.8 TYP
CLEAR WINDOW
2.12
0.250
3.00 0.250
NOTE B
Pb
TOP VIEW BOTTOM VIEW
SIDE VIEW
END VIEW
PIN 1
NOTES: A. All linear dimensions are in millimeters.
B. The center of the photo-active area is referenced to the upper left corner tip of the lead frame (Pin 1).
C. Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. This drawing is subject to change without notice.
Figure 10. Package D — Plastic Small Outline IC Packaging Configuration
TSL250RD, TSL251RD, TSL260RD, TSL261RD
LIGHT-TO-VOLTAGE OPTICAL SENSORS
TAOS050K ï OCTOBER 2007
8
r
r
Copyright E 2007, TAOS Inc.
The LUMENOLOGY r Company
www.taosinc.com
MECHANICAL DATA
0.292 0.013
[0.0115 0.0005]
2.11 0.10 [0.083 0.004]
2 0.05
[0.079
0.002]
4 0.1
[0.157
0.004]
1.75 0.10
[0.069 0.004]
12 + 0.3 ï 0.1
[0.472 + 0.12 ï 0.004]
SIDE VIEW
TOP VIEW
END VIEW
DETAIL B
5.50 0.05
[0.217 0.002]
8 0.1
[0.315
0.004]
1.50
B
B
AA
6.45 0.10
[0.254 0.004]
5.13 0.10
[0.202 0.004]
DETAIL A
A
o
B
o
K
o
NOTES: A. All linear dimensions are in millimeters [inches].
B. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
C. Symbols on drawing A
o
, B
o
, and K
o
are defined in ANSI EIA Standard 481ïB 2001.
D. Each reel is 178 millimeters in diameter and contains 1000 parts.
E. TAOS packaging tape and reel conform to the requirements of EIA Standard 481ïB.
F. This drawing is subject to change without notice.
Figure 11. Package D Carrier Tape
TSL250RD, TSL251RD, TSL260RD, TSL261RD
LIGHT-TO-VOLTAGE OPTICAL SENSORS
TAOS050K ï OCTOBER 2007
9
The LUMENOLOGY r Company
r
r
Copyright E 2007, TAOS Inc.
www.taosinc.com
MANUFACTURING INFORMATION
The Plastic Small Outline IC package (D) has been tested and has demonstrated an ability to be reflow soldered
to a PCB substrate.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The component should
be limited to a maximum of three passes through this solder reflow profile.
Table 1. TSL2xxRD Solder Reflow Profile
PARAMETER REFERENCE TSL2xxRD
Average temperature gradient in preheating 2.5qC/sec
Soak time t
soak
2 to 3 minutes
Time above 217qC t
1
Max 60 sec
Time above 230qC t
2
Max 50 sec
Time above T
peak
ï10qC t
3
Max 10 sec
Peak temperature in reflow T
peak
260q C (ï0qC/+5qC)
Temperature gradient in cooling Max ï5qC/sec
t
3
t
2
t
1
t
soak
T
3
T
2
T
1
T
peak
Not to scale — for reference only
Time (sec)
Temperature (C)
Figure 12. TSL2xxRD Solder Reflow Profile Graph
P1-P3P4-P6P7-P9P10-P12

TSL260RD-TR

Mfr. #:
Buy TSL260RD-TR
Manufacturer:
ams
Description:
Light To Frequency & Light To Voltage Light to Voltage Converter
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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