RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
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Infrared Reflow Peak temperature (package surface temperature) : 260°C or below
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Time at temperature of 220°C or higher : 60 seconds or less
Preheating time at 120 to 180° 021 : C ±30 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
IR260
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Time at temperature of 200°C or higher : 25 to 40 seconds
Preheating time at 120 to 150° sdnoces 06 ot 03 : C
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
VP215
Wave Soldering Peak temperature (molten solder temperature) : 260°C or below
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Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
WS260
Partial Heating Peak temperature (pin temperature) : 350°C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10454EJ02V0DS
9
μ
PG2179TB
