Package information MP23AB01DM
8/13 DocID029230 Rev 1
5 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
5.1 Soldering information
Figure 4. Recommended soldering profile limits
Table 6. Recommended soldering profile limits
Description Parameter Pb free
Average ramp rate T
L
to T
P
3 °C/sec max
Preheat
Minimum temperature
Maximum temperature
Time (T
SMIN
to T
SMAX
)
T
SMIN
T
SMAX
t
S
150 °C
200 °C
60 sec to 120 sec
Ramp-up rate T
SMAX
to T
L
Time maintained above liquidus temperature
Liquidus temperature
t
L
T
L
60 sec to 150 sec
217 °C
Peak temperature T
P
260 °C max
Time within 5 °C of actual peak temperature 20 sec to 40 sec
Ramp-down rate 6 °C/sec max
Time 25 °C (t = 25 °C) to peak temperature 8 minutes max
T25 °C to PEAK
RAMP -DOWN
RAMP -UP
t
s
PREHEAT
t
L
t
p
CRITICAL ZONE
T
L
to T
P
T
SMAX
T
SMIN
TIME
T
P
T
L
TEMPERATURE
30 60 90 120 150 180 210 240 270 300 330 360 390
