IRFS/SL5620PbF
2 www.irf.com
S
D
G
Repetitive rating; pulse width limited by max. junction temperature.
Starting T
J
= 25°C, L = 1.00mH, R
G
= 25Ω, I
AS
= 15A.
Pulse width ≤ 400µs; duty cycle ≤ 2%.
R
θ
is measured at T
J
of approximately 90°C.
Notes:
Limited by Tjmax. See Figs. 14, 15, 17a, 17b for repetitive
avalanche information
When mounted on 1" square PCB (FR-4 or G-10 Material). For
recommended footprint and soldering techniques refer to
application note #AN-994.
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units
BV
DSS
Drain-to-Source Breakdown Voltage 200 ––– ––– V
∆Β
V
DSS
∆
T
J
Breakdown Voltage Temp. Coefficient ––– 0.22 ––– V/°C
R
DS(on)
Static Drain-to-Source On-Resistance ––– 63.7 77.5
m
Ω
V
GS(th)
Gate Threshold Voltage 3.0 ––– 5.0 V
∆V
GS(th)
/∆T
J
Gate Threshold Voltage Coefficient ––– -14 ––– mV/°C
I
DSS
Drain-to-Source Leakage Current ––– ––– 20
––– ––– 250
I
GSS
Gate-to-Source Forward Leakage ––– ––– 100
Gate-to-Source Reverse Leakage ––– ––– -100
fs
Forward Transconductance 37 ––– ––– S
Q
g
Total Gate Charge ––– 25 38
Q
gs1
Pre-Vth Gate-to-Source Charge ––– 6.3 –––
Q
gs2
Post-Vth Gate-to-Source Charge ––– 1.9 –––
Q
gd
Gate-to-Drain Charge ––– 7.9 –––
Q
godr
Gate Charge Overdrive ––– 9.3 ––– See Fig. 6 and 19
Q
sw
Switch Char
e (Q
gs2
+ Q
gd
)
––– 9.8 –––
R
G(int)
Internal Gate Resistance ––– 2.6 5.0
Ω
t
d(on)
Turn-On Delay Time ––– 8.6 –––
t
r
Rise Time ––– 14.6 –––
t
d(off)
Turn-Off Delay Time ––– 17.1 –––
t
f
Fall Time ––– 9.9 –––
C
iss
Input Capacitance ––– 1710 –––
C
oss
Output Capacitance ––– 125 –––
C
rss
Reverse Transfer Capacitance ––– 30 –––
C
oss
Effective Output Capacitance ––– 138 –––
L
D
Internal Drain Inductance Between lead,
6mm (0.25in.)
L
S
Internal Source Inductance from package
Avalanche Characteristics
Parameter Units
E
AS
Sin
le Pulse Avalanche Ener
y
mJ
I
AR
Avalanche Current
A
E
AR
Repetitive Avalanche Ener
y
mJ
Diode Characteristics
Parameter Min. Typ. Max. Units
I
S
@ T
C
= 25°C
Continuous Source Current
(Body Diode)
I
SM
Pulsed Source Current
(Body Diode)
V
SD
Diode Forward Voltage ––– ––– 1.3 V
t
rr
Reverse Recovery Time ––– 98 147 ns
Q
rr
Reverse Recovery Charge ––– 491 737 nC
–––
––– –––
A
24
100
–––
––– –––
––– –––7.5
µA
nA
nC
ns
MOSFET symbol
R
G
= 2.4Ω
V
DS
= 50V, I
D
= 15A
Conditions
and center of die contact
V
DD
= 100V, V
GS
= 10V
V
DS
= 100V
V
DS
= 50V
V
DS
= V
GS
, I
D
= 100µA
V
DS
= 200V, V
GS
= 0V
V
GS
= 0V, V
DS
= 0V to 160V
V
DS
= 200V, V
GS
= 0V, T
J
= 125°C
V
GS
= 20V
V
GS
= -20V
V
GS
= 10V
I
D
= 15A
V
GS
= 0V
Conditions
V
GS
= 0V, I
D
= 250µA
Reference to 25°C, I
D
= 1mA
V
GS
= 10V, I
D
= 15A
T
J
= 25°C, I
F
= 15A , V
R
= 160V
di/dt = 100A/µs
T
J
= 25°C, I
S
= 15A, V
GS
= 0V
showing the
integral reverse
p-n junction diode.
I
D
= 15A
Typ. Max.
ƒ = 1.0MHz, See Fig.5
pF
nH
4.5
––– 113
See Fig. 14, 15, 17a, 17b