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FN6174.2
May 29, 2012
ISL88001, ISL88002, ISL88003
Small Outline Transistor Plastic Packages (SC70-3)
VIEW C
L
R1
R
4X θ1
4X θ1
GAUGE PLANE
L1
SEATING
α
L2
C
PLANE
c
BASE METAL
WITH
c1
b1
PLATING
b
D
e1
E
C
L
e
b
C
L
0.20 (0.008)
M
C
123
456
E1
C
L
C
VIEW C
C
L
A2
A
A1
0.10 (0.004) C
-C-
SEATING
PLANE
P3.049
3 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.031 0.043 0.80 1.10 -
A1 0.000 0.004 0.00 0.10 -
A2 0.031 0.039 0.80 1.00 -
b 0.009 0.016 0.25 0.40 -
b1 0.009 0.014 0.25 0.35
c 0.004 0.007 0.10 0.18 6
c1 0.004 0.007 0.10 0.16 6
D 0.071 0.087 1.80 2.20 3
E 0.071 0.094 1.80 2.40 -
E1 0.045 0.053 1.15 1.35 3
e 0.0256 Ref 0.65 Ref -
e1 0.0512 Ref 1.30 Ref -
L 0.010 0.018 0.26 0.46 4
L1 0.017 Ref. 0.420 Ref. -
L2 0.006 BSC 0.15 BSC
α
0° 8° 0° 8° -
N3 35
R 0.004 - 0.10 -
R1 0.004 0.010 0.15 0.25
Rev. 0 11/06
NOTES:
1. Dimensioning and tolerances per ASME Y14.5M-1994.
2. Package conforms to EIAJ SC70 and JEDEC MO-203AA.
3. Dimensions D and E1 are exclusive of mold flash, protrusions,
or gate burrs.
4. Footlength L measured at reference to gauge plane.
5. “N” is the number of terminal positions.
6. These Dimensions apply to the flat section of the lead between
0.08mm and 0.15mm from the lead tip.
7. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only.
