MEK300-06DA

© 2000 IXYS All rights reserved
1 - 2
Features
International standard package
with DCB ceramic base plate
Planar passivated chips
Short recovery time
Low switching losses
Soft recovery behaviour
Isolation voltage 3600 V~
UL registered E 72873
Applications
Antiparallel diode for high frequency
switching devices
Free wheeling diode in converters
and motor control circuits
Inductive heating and melting
Uninterruptible power supplies (UPS)
Ultrasonic cleaners and welders
Advantages
High reliability circuit operation
Low voltage peaks for reduced
protection circuits
Low noise switching
Low losses
Dimensions in mm (1 mm = 0.0394")
3000
3600
-40...+150
-40...+125
110
28800
29300
23300
23800
2400
2640
2160
2380
150
12.7
9.6
50
2.25-2.75/20-25
4.50-5.50/40-48
150 1.05
1.27
260 1.19
1.36
0.228
0.143
12
3
80
300 250 300
300 44
400 66
Preliminary data
I
FAVM
rating includes reverse blocking losses at T
VJM
, V
R
= 0.6 V
RRM
, duty cycle d = 0.5
Data according to IEC 60747
IXYS reserves the right to change limits, test conditions and dimensions
75 430 A
75 304
1640
0.85
1.34 mW
MEA 300-06DA MEK 300-06DA MEE 300-06DA
749
875
123 123 123
V
RSM
V
RRM
Type
V V
600 600
Symbol Test Conditions Maximum Ratings
I
FRMS
T
C
= °C
I
FAVM
T
C
= °C; rectangular, d = 0.5 A
I
FRM
t
P
< 10 ms; rep. rating, pulse width limited by T
VJM
A
I
FSM
T
VJ
= 45°C; t = 10 ms (50 Hz), sine A
t = 8.3 ms (60 Hz), sine A
T
VJ
= 150°C; t = 10 ms (50 Hz), sine A
t = 8.3 ms (60 Hz), sine A
I
2
t T
VJ
= 45°C; t = 10 ms (50 Hz), sine A
2
s
t = 8.3 ms (60 Hz), sine A
2
s
T
VJ
= 150°C; t = 10 ms (50 Hz), sine A
2
s
t = 8.3 ms (60 Hz), sine A
2
s
T
VJ
°C
T
stg
°C
T
Smax
°C
P
tot
T
C
= 25°CW
V
ISOL
50/60 Hz, RMS t = 1 min V~
I
ISOL
£ 1 mA t = 1 s V~
M
d
Mounting torque (M6) Nm/lb.in.
Terminal connection torque (M6) Nm/lb.in.
d
S
Creeping distance on surface mm
d
A
Strike distance through air mm
a Maximum allowable acceleration m/s
2
Weight g
Symbol Test Conditions Characteristic Values (per diode)
typ. max.
I
R
T
VJ
= 25°CV
R
= V
RRM
mA
T
VJ
= 25°CV
R
= 0.8 • V
RRM
mA
T
VJ
= 125°CV
R
= 0.8 • V
RRM
mA
V
F
I
F
= A; T
VJ
=125°CV
T
VJ
=25°CV
I
F
= A; T
VJ
=125°CV
T
VJ
=25°CV
V
T0
For power-loss calculations only V
r
T
R
thJH
DC current K/W
R
thJC
DC current K/W
t
rr
I
F
= A T
VJ
= 100°Cns
I
RM
V
R
= V T
VJ
= 25°CA
-di/dt = A/msT
VJ
= 100°CA
Fast Recovery
Epitaxial Diode
(FRED) Module
MEA 300-06 DA
MEK 300-06 DA
MEE 300-06 DA
V
RRM
= 600 V
I
FAVM
= 304 A
t
rr
= 250 ns
1
2
3
© 2000 IXYS All rights reserved
2 - 2
200 600 10000 400 800
200
250
300
350
400
0.001 0.01 0.1 1 10
0.00
0.05
0.10
0.15
0.20
0.25
0 40 80 120 160
0.4
0.6
0.8
1.0
1.2
1.4
K
f
T
VJ
°C
-di
F
/dt
t
s
K/W
0 200 400 600 800 1000
10
30
50
0
20
40
60
0.0
0.5
1.0
1.5
2.0
2.5
3.0
V
FR
di
F
/dt
V
200 600 10000 400 800
0
50
100
150
200
100 1000
0
5
10
15
20
0.0 0.4 0.8 1.2 1.6
0
100
200
300
400
500
I
RM
Q
r
I
F
A
V
F
-di
F
/dt
-di
F
/dt
A/ s
A
V
µC
A/ s
A/ s
t
rr
ns
t
fr
Z
thJS
A/ s
µs
MEA 300-06 DA MEE 300-06 DA
MEK 300-06 DA
814
Fig. 7 Transient thermal impedance junction to heatsink
T
VJ
= 100°C
V
R
= 300V
T
VJ
= 100°C
I
F
= 300A
Constants for Z
thJS
calculation:
iR
thi
(K/W) t
i
(s)
1 0.002 0.08
2 0.008 0.024
3 0.054 0.112
4 0.164 0.464
T
VJ
= 100°C
V
R
= 300V
T
VJ
= 100°C
V
R
= 300V
Q
r
I
RM
T
VJ
=125°C
T
VJ
=25°C
I
F
= 600A
I
F
= 300A
I
F
= 150A
I
F
= 600A
I
F
= 300A
I
F
= 150A
I
F
= 600A
I
F
= 300A
I
F
= 150A
V
FR
t
fr
Fig. 3 Typ. peak reverse current I
RM
versus -di
F
/dt
Fig. 2 Typ. reverse recovery
charge Q
r
versus -di
F
/dt
Fig. 1 Forward current I
F
versus
max. voltage drop V
F
per leg
Fig. 4 Dynamic parameters Q
r
, I
RM
versus junction temperature T
VJ
Fig. 5 Typ. recovery time t
rr
versus -di
F
/dt
Fig. 6 Typ. peak forward voltage V
FR
and t
fr
versus di
F
/dt
Z
thJH

MEK300-06DA

Mfr. #:
Manufacturer:
Littelfuse
Description:
Discrete Semiconductor Modules 600 Amps 600V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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