TIS74

©2002 Fairchild Semiconductor Corporation Rev. B1, November 2002
TIS73/TIS74
TO-92
Absolute Maximum Ratings *
T
A
=25°C unless otherwise noted
* These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
NOTES:
1. These ratings are based on a maximum junction temperature of 150 degrees C.
2. These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
Electrical Characteristics
T
A
=25°C unless otherwise noted
* Pulse Test: Pulse Width 300µs, Duty Cycle 3.0%
Symbol Parameter Value Units
V
DG
Drain-Gate Voltage 30 V
V
GS
Gate-Source Voltage -30 V
I
GF
Forward Gate Current 10 mA
T
J
, T
STG
Operating and Storage Junction Temperature Range -55 ~ +150 °C
Symbol Parameter Test Condition Min. Typ. Max. Units
Off Characteristics
V
(BR)GSS
Gate-Source Breakdown Voltage I
G
= 1.0µA, V
DS
= 0 -30 V
I
GSS
Gate Reverse Current V
GS
= 15V, V
DS
= 0
V
GS
= 15V, V
DS
= 0, T
a
= 100°C
-2.0
-5.0
nA
µA
I
D
(off) Drain Cutoff Leakage Current V
DS
= 15V, V
GS
= -10V
V
DS
= 15V, V
GS
= -10V,
T
a
= 100°C
-2.0
-5.0
nA
µA
V
GS
(off) Gate-Source Cutoff Voltage V
DS
= 15V, I
D
= 4.0nA TIS73
TIS74
-4.0
-2.0
-10
-6.0
V
V
On Characteristics *
I
DSS
Zero-Gate Voltage Drain Current * V
DS
= 15V, V
GS
= 0 TIS73
TIS74
50
20 100
mA
mA
r
DS
(on) Drain-Source On Resistance V
DS
0.1V, V
GS
= 0 TIS73
f = 1.0KHz TIS74
25
40
Small Signal Characteristics
C
iss
Input Capacitance V
DS
= 0, V
GS
= -10V, f = 1.0MHz 18 pF
C
rss
Reverse Transfer Capacitance V
DS
= 0, V
GS
= -10V, f = 1.0MHz 8.0 pF
Switching Characteristics
t
r
Rise Time V
GS
(off) = -10V, V
GS
(on) = 0,
I
D
= 20mA, V
DS
= 10V TIS73
TIS74
3.0
4.0
ns
ns
t
on
Turn-On Time V
GS(off)
= -10V, V
GS
(on) = 0,
I
D
= 20mA, V
DS
= 10V 6.0 ns
t
off
Turn-Off Time V
GS
(off) = -10V, V
GS
(on) = 0,
I
D
= 20mA, V
DS
= 10V TIS73
TIS74
25
50
ns
ns
TIS73/TIS74
N-Channel General Purpose Amplifier
This device is designed for low level analog switching, sample and
hold circuits and chopper stabilized amplifiers.
Sourced from process 54.
1. Gate 2. Source 3. Drain
1
©2002 Fairchild Semiconductor Corporation Rev. B1, November 2002
TIS73/TIS74
Thermal Characteristics T
A
=25°C unless otherwise noted
Symbol Parameter Max. Units
P
D
Total Device Dissipation
Derate above 25
°C
350
2.8
mW
mW/°C
R
θJC
Thermal Resistance, Junction to Case 125 °C/W
R
θJA
Thermal Resistance, Junction to Ambient 357 °C/W
©2002 Fairchild Semiconductor Corporation Rev. B1, November 2002
TIS73/TIS74
Typical Characateristics
Figure 1. Transfer Characteristics
Figure 2. Transfer Characteristics
Figure 3. Transfer Characteristics
Figure 4. Capacitance vs Voltage
Figure 5. Common Drain-Source Characteristics Figure 6. Power Dissipation vs
Ambient Temperature
V - GATE-SOURCE VOLTAGE(V)
I - DRAIN CURRENT (mA)
DSS
GS
1235710
5
10
20
50
100
200
500
IDSS @VDS=15V PULSE
rds - DRAIN ON RESISTANCE (
)
ON
V - GATE-SOURCE VOLTAGE(V)
GS
1235710
5
10
20
30
50
100
rdsON @VDS=100MV VGS=0V
V - GATE-SOURCE VOLTAGE(V)
gfs - TRANSCONDUCTANCE (mmho)
GS
1235710
5
10
20
30
50
gfs @ VDS=15V VGS=0V
gfs @ VDS=15V ID=3mA
-14-12-10-8-6-4-20
5
10
20
V - GATE-SOURCE VOLTAGE (V)
Cis (Crs) - CAPACITANCE (pf)
f = 0.1-1.0MHz
C ( V = 10 V )
is
DS
C ( V = 0 V )
rs
DS
GS
0246810
0
20
40
60
80
100
V - DRAIN -SOURCE VOLTAGE (V)
I - DRAIN CURRENT (mA)
V = 0V
GS
-1V
-2V
-3V
-4V
TYP V = - 5V
GS(OFF)
DS
T = + 25 C
0
A
D
0 255075100125150
0
50
100
150
200
250
300
350
TEMPERATURE ( C)
P - POWER DISSIPATION (mW)
D
o
TO-92

TIS74

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
JFET N-CH 30V 0.35W TO92
Lifecycle:
New from this manufacturer.
Delivery:
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