5514-25 Datasheet 5514-20, 5514-25 | P1-P3

3M™ Thermally Conductive Interface Silicone Pad 5514

Product Description

Note: The data presented in this preliminary data sheet are 3M’s best estimates for the current product construction being

evaluated. While this product is being developed for general commercialization, this product is still considered

developmental at this time and changes in product construction or process conditions may occur that can cause

subsequent changes in product characteristics or performance. User should consult with 3M before making any

business plans in reliance upon the future availability or the current properties of this product.

3M™ Thermally Conductive Interface Silicone Pad 5514 has good softness for good gap filling performance and reliable

dimensional stability that is useful for complicated pattern making through the die cutting process. The Pad 5514 product

was originally designed to provide a preferential heat transfer path between heat generating components and heat sinks,

heat spreaders or other cooling devices. The Pad 5514 product is a thermally conductive silicone interface pad product and

it consists of a highly conformable and tacky silicone elastomeric sheet filled with thermally conductive ceramic particles

which provide good thermal heat transfer and electrical insulation performance.

Product Uses

This product can be used for heat management of electronic devices and joining/stacking parts in electronic components.

Technical Data January 2011

Preliminary

Developmental Status Notice

3M™ Thermally Conductive Interface Silicone Pad 5514 is a 3M developmental product. It is currently available on a

limited basis and is only provided for market and technical evaluation. The future availability, formulation, performance

properties, and pricing for the material are not guaranteed and are subject to change. To discuss your evaluation, please

contact your local 3M Technical Service.

3M™ Thermally Conductive Interface Silicone Pad 5514

Product Construction

3M™ Thermally Conductive Interface Silicone Pad 5514-20 (25)

Removable Film liner

Thermally conductive silicone elastomer

Removable Film liner

Standard thickness (excluding liner): 0.2 (0.25) mm

Application Ideas

• IC Packaging Heat Conduction

• Printed Circuit Board

• Spacer for Battery Module/Pack

• Heat Sink by Aluminum, other metal and ceramic

• COF Chip Heat Conduction

• LED Board TIM

• HD TV Address IC Chip and Scan Module

• Thin Gap Filling between board, module and chassis

Mechanical fastening such as clamp, bracket, screw and additional tapes and adhesives bonding can be used in parallel

with this pad.

Key Features

• Thin for lower thermal impedance, 0.20mm and 0.25mm thick products available

• Excellent softness and conformability even to non-flat surfaces

• Good dimensional stability to improve the converting process and ease to make complex die cut patterns

• Good thermal conductivity

• Excellent electrical insulation properties

• High pressure relaxation capability

• Surface tack allows pre-assembly

(2)

3M™ Thermally Conductive Interface Silicone Pad 5514

(3)

Typical Physical Properties and Performance Characteristics

Note: The following technical information and data is based upon limited 3M testing conditions and should not be used for

specification purposes.

3M™ Thermally Conductive Interface Silicone Pad 5514-20 / 5514-25

Property Method Value

Thickness (mm) 0.2 / 0.25 (±0.025mm)

Thermal Conductivity (W/mK)* QTM-500 1.6

Flammability* UL 94 V-0 (Passed 3M Internal FR Test)

Density (g/cm

, @ 25°C)* TS-TM-441 2.4 (±0.25)

Hardness (Shore 00)* ASTM D2240 55 (±10)

Volume Resistivity (Ω-cm)* ASTM D257 8.6 x 10

Dielectric Strength (kV/mm)* ASTM D149 14.1

Dielectric Constant* ASTM D150

100 Hz 1 Khz 1 Mhz

15.7 15.7 15.6

*3M™ Thermally Conductive Interface Silicone Pad 5514-25 tested.

Heat resistance of 3M™ Thermally Conductive Interface Silicone Pad 5514-25

Duration Initial 100 500 1000

Thermal Conductivity (W/mK) 1.6 1.6 1.6 1.6

Hardness (Shore 00) 56 56 56 56

Appearance No effect No effect No effect

Aged at 130°C in high temperature chamber.

Application Techniques

• Positioning and adhesion strength is dependent upon the total amount of surface contact developed. Firm application

pressure helps develop better wetting and improve adhesion.

• To obtain optimum thermal conductivity, the wetting surfaces must be maximized. For better contact, clean, dry and well

unified surface condition is recommended. Typical surface cleaning solvents are isopropyl alcohol and water (rubbing

alcohol) or heptane. Note: Be sure to follow manufacturer’s safety precautions and directions for use when using

solvents.

• Ideal application temperature range is from 0°C to 40°C. Initial application to surfaces at temperatures below 0°C is not

recommended because the pad becomes too firm to be wetted readily. However, once properly applied, low temperature

holding is generally satisfactory.

P1-P3 P4-P4

5514-25

Mfr. #:

Buy 5514-25

Manufacturer:

Description:

Thermal Interface Products Silicon Intrfac Pad 400mm x 20m

Lifecycle:

New from this manufacturer.

Delivery:

DHL FedEx Ups TNT EMS

Payment:

T/T Paypal Visa MoneyGram Western Union

5514-25

5514-25

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