DATA SHEET
SE5511T: Dual Band 802.11n WLAN/BT Front End
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
202403A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • October 23, 2012 12
Recommended PCB Footprint
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Figure 5: Recommended PCB footprint
Because of its sensitivity to moisture absorption, instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption
may occur when the part is subjected to high temperature during solder assembly. The SE5511T is capable of
withstanding a Pb free solder reflow. Care must be taken when attaching this product, whether it is done manually or
in a production solder reflow environment. If the part is manually attached, precaution should be taken to insure that
the device is not subjected to temperatures above its rated peak temperature for an extended period of time. For
details on both attachment techniques, precautions, and handling procedures recommended, please refer to:
“Quad Flat No-Lead Module Solder Reflow & Rework Information”, Document Number QAD-00045.
“Handling, Packing, Shipping and Use of Moisture Sensitive QFN”, Document Number QAD-00044.
