
SSM2377
Rev. 0 | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings apply at 25°C, unless otherwise noted.
Table 2.
Parameter Rating
Supply Voltage 6 V
Input Voltage V
DD
Common-Mode Input Voltage V
DD
Storage Temperature Range −65°C to +150°C
Operating Temperature Range −40°C to +85°C
Junction Temperature Range −65°C to +165°C
Lead Temperature (Soldering, 60 sec) 300°C
ESD Susceptibility 4 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Junction-to-air thermal resistance (θ
JA
) is specified for the worst-
case conditions, that is, a device soldered in a printed circuit
board (PCB) for surface-mount packages. θ
JA
is determined
according to JEDEC JESD51-9 on a 4-layer PCB with natural
convection cooling.
Table 3. Thermal Resistance
Package Type PCB θ
JA
Unit
9-Ball, 1.2 mm × 1.2 mm WLCSP 2S2P 88 °C/W
ESD CAUTION