F-1
XR2IC Sockets
OMRON’s IC Connectors Have Excellent
Reliability and Can Tolerate Momentary
Interruptions in Power. Ideal for High-
speed Data Processing.
■ Round pins and 4-point (4-finger) contact construction
ensure long life and excellent shock and vibration dura-
bility.
■ Contact entry holes are large for easy insertion.
■ IC lead contacts placed high for solid connections.
■ No flux rise.
■ A wide product range: open-frame, closed-frame, sin-
gle-row, carrier-type DIP terminals, wrap terminals, sol-
der-sleeve terminals, and low-profile DIP terminals.
■ A new tin-plated product series offers more choice
when it comes to selecting the optimum IC Socket for
an application.
■ Conform to UL standards (file no. E 103202) and CSA
standards (file no. LR 62678).
■ Ratings and Characteristics
Note: The contact insertion force and contact removal force are for a test
gauge, t = 0.432 mm.
■ Materials and Finish
Note: For non-standard plating, contact your OMRON representative.
■ Applicable Wrap Post Wire Sizes
AWG30, AWG28, AWG26, AWG24
(Solid wire: 0.25 to 0.51 mm dia.)
■ Wrap Post Length
3 wires
■ Applicable IC Lead Dimensions
DIP, Wrap, and Solder-sleeve Terminals
Note: Do not use wire where the diagonal is more than 0.56 mm.
Low-profile DIP Terminals
Note: Do not use wire where the diagonal is more than 0.52 mm.
Inner clip
Base
Outer sleeve
Carrier
Inner clip
Outer sleeve
1.83 dia.
0.51 dia.
1.83 dia.
0.635 × 0.635
1.83 dia.
0.79 dia.
1.83 dia.
1.35 dia.
■ Construction
■ Contact Dimensions
DIP Terminals
Wrap
Terminals
Low-profile DIP
Terminals
Solder-sleeve
Terminals
Item Gold plated Gold flash plated
Rated current 1 A
Rated voltage 300 VAC
Contact resistance 20 mΩ max. (at 20 mV, 100 mA max.)
Insulation resistance 1,000 MΩ min. (at 500 VDC)
Dielectric strength 1,000 VAC for 1 min (leakage current: 1 mA max.)
Contact insertion (See note.) 3.92 N max.
Contact removal (See note.) 0.64 N min. with gold plating, 0.64 N min. with solder
plating
Insertion durability 100 times (0.75-µm gold
plating), 50 times (0.25-
µm gold plating)
20 times
Ambient temperature Operating: − 55 to 125°C (with no icing)
Base Fiber-glass reinforced PBT resin (UL94V-0)/black
Carrier Aluminum
Inner clip Beryllium copper/nickel base, gold plated
Outer sleeve Brass/nickel base, gold flash plating
Depth × width (mm)
Flat lead 0.29 ±0.09 × 0.46 ±0.08 (See note.)
Round lead 0.53 dia. max. 0.41 dia. min.
Depth × width (mm)
Flat lead 0.29 ±0.09 × 0.46 ±0.08 (See note.)
Round lead 0.50 dia. max. 0.41 dia. min.
