PDTB113Z_SER_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 16 November 2009 4 of 10
NXP Semiconductors
PDTB113Z series
PNP 500 mA resistor-equipped transistors; R1 = 1 kΩ, R2 = 10 kΩ
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
7. Characteristics
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance
from junction to
ambient
in free air
[1]
SOT346 - - 500 K/W
SOT54 - - 250 K/W
SOT23 - - 500 K/W
Table 8. Characteristics
T
amb
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
I
CBO
collector-base cut-off
current
V
CB
= −40 V; I
E
=0A - - −100 nA
V
CB
= −50 V; I
E
=0A - - −100 nA
I
CEO
collector-emitter
cut-off current
V
CE
= −50 V; I
B
=0A - - −0.5 μA
I
EBO
emitter-base cut-off
current
V
EB
= −5V; I
C
=0A - - −0.8 mA
h
FE
DC current gain V
CE
= −5V; I
C
= −50 mA 70 - -
V
CEsat
collector-emitter
saturation voltage
I
C
= −50 mA; I
B
= −2.5 mA - - −0.3 mV
V
I(off)
off-state input
voltage
V
CE
= −5V; I
C
= −100 μA −0.3 −0.6 −1.0 V
V
I(on)
on-state input
voltage
V
CE
= −0.3 V;
I
C
= −20 mA
−0.4 −0.8 −1.4 V
R1 bias resistor 1 (input) 0.7 1.0 1.3 kΩ
R2/R1 bias resistor ratio 9 10 11
C
c
collector capacitance V
CB
= −10 V; I
E
=i
e
=0A;
f=100MHz
-11-pF