LTC2955
19
2955fa
For more information www.linear.com/LTC2955
package DescripTion
Please refer to http://www.linear.com/product/LTC2955#packaging for the most recent package drawings.
2.00 ±0.10
(2 SIDES)
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
0.40 ±0.10
BOTTOM VIEW—EXPOSED PAD
0.64 ±0.05
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
R = 0.05
TYP
2.39 ±0.05
(2 SIDES)
3.00 ±0.10
(2 SIDES)
15
106
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0 – 0.05
(DDB10) DFN 0905 REV Ø
0.25 ±0.05
0.50 BSC
PIN 1
R = 0.20 OR
0.25 × 45°
CHAMFER
0.25 ±0.05
2.39 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.64 ±0.05
(2 SIDES)
1.15 ±0.05
0.70 ±0.05
2.55 ±0.05
PACKAGE
OUTLINE
0.50 BSC
DDB Package
10-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1722 Rev Ø)