OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

AT24C11-10PI-2.7

P1-P3P4-P6P7-P9P10-P12P13-P15
10
AT24C11
3409E–SEEPR–1/05
Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC Characteristics
tables.
2. “U” designates Green package + RoHS compliant.
3. Die sales available in waffle pack and wafer form, order as SL719 for wafer form. Bumped die sales available upon request.
Please contact Serial EEPROM Marketing.
AT24C11 Ordering Information
(1)
Ordering Code Package Operation Range
AT24C11-10PI-2.7
AT24C11N-10SI-2.7
AT24C11-10TI-2.7
8P3
8S1
8A2
Industrial Temperature
(–40°C to 85°C)
AT24C11-10PI-1.8
AT24C11N-10SI-1.8
AT24C11-10TI-1.8
8P3
8S1
8A2
Industrial Temperature
(–40°C to 85°C)
AT24C11-10PU-2.7
(2)
AT24C11-10PU-1.8
(2)
AT24C11N-10SU-2.7
(2)
AT24C11N-10SU-1.8
(2)
AT24C11-10TU-2.7
(2)
AT24C11-10TU-1.8
(2)
AT24C11-10TSU-2.7
(2)
AT24C11-10TSU-1.8
(2)
8P3
8P3
8S1
8S1
8A2
8A2
5TS1
5TS1
Lead-free/Halogen-free/
Industrial Temperature
(–40°C to 85°C)
AT24C11-W2.7-11
(3)
AT24C11-W1.8-11
(3)
Die Sale
Die Sale
Industrial Temperature
(–40°C to 85°C)
Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2 8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
5TS1 5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
Options
–2.7 Low-Voltage (2.7V to 5.5V)
–1.8 Low-Voltage (1.8V to 5.5V)
11
AT24C11
3409E–SEEPR–1/05
Packaging Information
8P3 – PDIP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
01/09/02
8P3
B
D
D1
E
E1
e
L
b2
b
A2 A
1
N
eA
c
b3
4 PLCS
Top View
Side View
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E
and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
A 0.210 2
A2 0.115 0.130 0.195
b 0.014 0.018 0.022 5
b2 0.045 0.060 0.070 6
b3 0.030 0.039 0.045 6
c 0.008 0.010 0.014
D 0.355 0.365 0.400 3
D1 0.005 3
E 0.300 0.310 0.325 4
E1 0.240 0.250 0.280 3
e 0.100 BSC
eA 0.300 BSC 4
L 0.115 0.130
12
AT24C11
3409E–SEEPR–1/05
8S1 – JEDEC SOIC
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
DRAWING NO.
R
REV.
Note:
10/7/03
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
8S1 B
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A1 0.10 – 0.25
These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
A 1.35 – 1.75
b 0.31 – 0.51
C 0.17 – 0.25
D 4.80 – 5.00
E1 3.81 – 3.99
E 5.79 – 6.20
e 1.27 BSC
L 0.40 – 1.27
∅ 0˚ – 8˚
∅
Top View
End View
Side View
e
B
D
A
A1
N
E
1
C
E1
L
P1-P3P4-P6P7-P9P10-P12P13-P15

AT24C11-10PI-2.7

Mfr. #:
Buy AT24C11-10PI-2.7
Manufacturer:
Description:
IC EEPROM 1K I2C 1MHZ 8DIP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet