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74AHC241PW,118

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
74AHC_AHCT241_1 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 11 January 2010 9 of 15
NXP Semiconductors
74AHC241; 74AHCT241
Octal buffer/line driver; 3-state
Test data is given in Table 9.
Definitions test circuit:
R
T
= Termination resistance should be equal to output impedance Z
o
of the pulse generator.
C
L
= Load capacitance including jig and probe capacitance.
R
L
= Load resistance.
S1 = Test selection switch.
Fig 8. Load circuitry for switching times
V
M
V
M
t
W
t
W
10 %
90 %
0 V
V
I
V
I
negative
pulse
positive
pulse
0 V
V
M
V
M
90 %
10 %
t
f
t
r
t
r
t
f
001aad98
3
DUT
V
CC
V
CC
V
I
V
O
R
T
R
L
S1
C
L
open
G
Table 9. Test data
Type Input Load S1 position
V
I
t
r
, t
f
C
L
R
L
t
PHL
, t
PLH
t
PZH
, t
PHZ
t
PZL
, t
PLZ
74AHC241 V
CC
3.0 ns 15 pF, 50 pF 1 kΩ open GND V
CC
74AHCT241 3.0 V 3.0 ns 15 pF, 50 pF 1 kΩ open GND V
CC
74AHC_AHCT241_1 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 11 January 2010 10 of 15
NXP Semiconductors
74AHC241; 74AHCT241
Octal buffer/line driver; 3-state
12. Package outline
Fig 9. Package outline SOT163-1 (SO20)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1) (1)
eH
E
LL
p
Q
Z
ywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
inches
2.65
0.3
0.1
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT163-1
10
20
w M
b
p
detail X
Z
e
11
1
D
y
0.25
075E04 MS-013
pin 1 index
0.1
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.51
0.49
0.30
0.29
0.05
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
0 5 10 mm
scale
X
θ
A
A
1
A
2
H
E
L
p
Q
E
c
L
v M
A
(A )
3
A
S
O20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163
-1
99-12-27
03-02-19
74AHC_AHCT241_1 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 11 January 2010 11 of 15
NXP Semiconductors
74AHC241; 74AHCT241
Octal buffer/line driver; 3-state
Fig 10. Package outline SOT360-1 (TSSOP20)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.5
0.2
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1 MO-153
99-12-27
03-02-19
w M
b
p
D
Z
e
0.25
110
20
11
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
y
0 2.5 5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360
-1
A
max.
1.1
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

74AHC241PW,118

Mfr. #:
Buy 74AHC241PW,118
Manufacturer:
NXP Semiconductors
Description:
IC BUF NON-INVERT 5.5V 20TSSOP
Lifecycle:
New from this manufacturer.
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