MKT1820
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Vishay Roederstein
Revision: 24-Nov-16
12
Document Number: 26011
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POWER DISSIPATION AND MAXIMUM COMPONENT TEMPERATURE RISE
The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function
of the free air ambient temperature.
The component temperature rise (T) can be measured or calculated by T = P/G:
• T = component temperature rise (°C) with a maximum of 15 °C
• P = power dissipation of the component (mW)
• G = heat conductivity of the component (mW/°C)
MEASURING THE COMPONENT TEMPERATURE
A thermocouple must be attached to the capacitor body as in:
The temperature is measured in unloaded (T
amb
) and maximum loaded condition (T
C
).
The temperature rise is given by T = T
C
- T
amb
.
To avoid thermal radiation or convection, the capacitor must be tested in a closed area from air circulation.
HEAT CONDUCTIVITY (G) AS A FUNCTION OF CAPACITOR BODY THICKNESS IN mW/°C
W
max.
(mm)
HEAT CONDUCTIVITY (mW/°C)
PITCH 10.0 mm PITCH 15.0 mm PITCH 22.5 mm PITCH 27.5 mm PITCH 37.5 mm PITCH 52.5 mm
3.5 5.0 - - - - -
4.0 6.0 - - - - -
4.5 7.0 - - - - -
5.5 8.0 10.0 - - - -
6.5 10.0 13.0 20.0 - - -
7.5 - 15.0 22.0 - - -
8.5 - 16.0 24.0 - - -
9.0 - - - 32.0 - -
10.5 - - 30.0 - - -
11.0 - - - 38.0 - -
11.5 - - - 38.0 - -
12.5 - - 34.0 - - -
13.0 - - - 45.0 - -
13.5 - - - 45.0 - -
15.0 - - - 50.0 - -
16.5 - - - 58.0 - -
18.0 - - - 60.0 - -
18.5 - - - - 90.0 -
20.0 - - - 73.0 - -
21.0 - - - 70.0 - -
21.5 - - - - 102.0 -
24.0 - - - - 118.0 -
25.0 - - - - - 155.0
30.0 - - - - 135.0 170.0
35.0 - - - - - 200.0
