BD3504FVM,BD3500FVM,BD3501FVM,BD3502FVM
Technical Note
13/16
www.rohm.com
2010.05 - Rev.A
© 2010 ROHM Co., Ltd. All rights reserved.
Notes for use
1. Absolute maximum ratings
For the present product, thoroughgoing quality control is carried out, but in the event that applied voltage, working
temperature range, and other absolute maximum rating are exceeded, the present product may be destroyed. Because
it is unable to identify the short mode, open mode, etc., if any special mode is assumed, which exceeds the absolute
maximum rating, physical safety measures are requested to be taken, such as fuses, etc.
2. GND potential
Bring the GND terminal potential to the minimum potential in any operating condition.
3. Thermal design
Consider allowable loss (Pd) under actual working condition and carry out thermal design with sufficient margin provided.
4. Terminal-to-terminal short-circuit and erroneous mounting
When the present IC is mounted to a printed circuit board, take utmost care to direction of IC and displacement. In the
event that the IC is mounted erroneously, IC may be destroyed. In the event of short-circuit caused by foreign matter that
enters in a clearance between outputs or output and power-GND, the IC may be destroyed.
5. Operation in strong electromagnetic field
The use of the present IC in the strong electromagnetic field may result in maloperation, to which care must be taken.
6. Built-in thermal shutdown protection circuit
The present IC incorporates a thermal shutdown protection circuit (TSD circuit). The working temperature is 175°C
(standard value) and has a -15 (standard value) hysteresis width. When the IC chip temperature rises and the TSD
circuit operates, the output terminal is brought to the OFF state. The built-in thermal shutdown protection circuit (TSD
circuit) is first and foremost intended for interrupt IC from thermal runaway, and is not intended to protect and warrant the
IC. Consequently, never attempt to continuously use the IC after this circuit is activated or to use the circuit with the
activation of the circuit premised.
7. Capacitor across output and GND
In the event a large capacitor is connected across output and GND, when Vcc and VIN are short-circuited with 0V or GND
for some kind of reasons, current charged in the capacitor flows into the output and may destroy the IC. Use a capacitor
smaller than 1000 µF between output and GND.
8. Inspection by set substrate
In the event a capacitor is connected to a pin with low impedance at the time of inspection with a set substrate, there is a
fear of applying stress to the IC. Therefore, be sure to discharge electricity for every process. As electrostatic
measures, provide grounding in the assembly process, and take utmost care in transportation and storage. Furthermore,
when the set substrate is connected to a jig in the inspection process, be sure to turn OFF power supply to connect the jig
and be sure to turn OFF power supply to remove the jig.
9. IC terminal input
The present IC is a monolithic IC and has a P substrate and P+ isolation between elements.
With this P layer and N layer of each element, PN junction is formed, and when the potential relation is
GND>terminal A>terminal B, PN junction works as a diode, and
terminal B>GND terminal A, PN junction operates as a parasitic transistor.
The parasitic element is inevitably formed because of the IC construction. The operation of the parasitic element gives
rise to mutual interference between circuits and results in malfunction, and eventually, breakdown. Consequently, take
utmost care not to use the IC to operate the parasitic element such as applying voltage lower than GND (P substrate) to
the input terminal.
(PIN A)
P+ P+
N N
N
P
P substrate
GND GND
N
P
N
C
B
E
GND
P+ P+
N
N
Resistor NPN Transistor Structure (NPN)
(PIN B)
Parasitic diode
GND
(PIN A)
C
E
B
GND
Nearby other device
(PIN B)
Parasitic diode
Parasitic diode
Parasitic diode
P substrate
BD3504FVM,BD3500FVM,BD3501FVM,BD3502FVM
Technical Note
14/16
www.rohm.com
2010.05 - Rev.A
© 2010 ROHM Co., Ltd. All rights reserved.
10. Output capacitor (C5)
Connect the output capacitor between Vo1, Vo2 terminals and GND terminal without fail in order to stabilize output voltage.
The output capacitor has a role to compensate for the phase of loop gain and to reduce output voltage fluctuation when
load is rapidly changed. When there is an insufficient capacity value, there is a possibility to cause oscillation, and when
the equivalent serial resistance (ESR) of the capacitors is large, output voltage fluctuation is increased when load is rapidly
changed. About 220 µF high-performance electrolytic capacitors are recommended, but this greatly depends on the gate
capacity of external MOSFET and mutual conductance (gm), temperature and load conditions. In addition, when only
ceramic capacitors with low ESR are used, or various capacitors are connected in series, the total phase allowance of loop
gain becomes not sufficient, and oscillation may result. Thoroughgoing confirmation at application temperature and
under load range conditions is requested.
11. Input capacitor setting method (C1, C4)
The input capacitor plays a part to lower output impedance of a power supply connected to input terminals (Vcc, VIN).
When output impedance of this power supply increases, the input voltages (Vcc, VIN) become unstable and there is a
possibility of giving rise to oscillation and degraded ripple rejection characteristics. The use of capacitors of about 10 µF
with low ESR, which provide less capacity value changes caused by temperature changes, is recommended, but since
input capacitor greatly depends on characteristics of the power supply used for input, substrate wiring pattern, and
MOSFET gate-drain capacity, thoroughgoing confirmation under the application temperature, load range, and M-MOSFET
conditions is requested.
12. NRCS terminal capacitor setting method (C3)
To the present IC, there mounted is a function (Non Rush Current on Start-up: NRCS) to prevent rush current from VIN to
load and output capacitor via Vo at the output voltage start-up. When the EN terminal is reset from Hi or UVLO, constant
current is allowed to flow from the NRCS terminal. By this current, voltage generated at the NRCS terminal becomes the
reference voltage and output voltage is started. In order to stabilize the NRCS set time, it is recommended to use a
capacitor (B special) with less capacity value change caused by temperature change.
13. SCP terminal capacitor setting method (C2)
The present IC incorporates a timer-latch type short-circuit protection circuit in order to prevent MOSFET from being
destroyed by abnormal current when output terminal is short-circuited (operates at the time of NRCS, too). When the
output terminal voltage drops 30% from output setting voltage, IC judges that the output is short-circuited. In such event,
constant current begins to flow. When the voltage generated in the SCP terminal reaches 1.3V (Typ) by this current, the
gate terminal is brought to the Low level. In order to stabilize the SCP setting time, a capacitor (B special) with less
capacity value change caused by temperature changes is recommended. When the SCP function is not used,
short-circuit the SCP terminal to the GND terminal. In addition, when the output terminal is short-circuited, the MOSFET
gate voltage reaches the Vcc voltage and the large current that meets MOSFET characteristics flows to the output while
the timer latch type protection circuit operates. When the current capacity of VIN terminal power supply lacks, the Vin
terminal voltage lowers and the UVLO circuit operates, and the latch operation may not be finished. In such event,
connect a limiting resistor across drain terminal and VIN terminal of MOSFET.
14. Input terminals (VCC, VIN, EN)
In the present IC, N terminal, VIN terminal, and VCC terminal have an independent construction. In addition, in order to
prevent malfunction at the time of low input, the UVLO function is equipped with the VIN terminal and the VCC terminal.
They begin to start output voltage when all the terminals reach threshold voltage without depending on the input order of
input terminals.
15. Maximum output current (maximum load)
The maximum output current capacity of the power supply which is composed by the use of the present IC depends on the
external FET. Consequently, confirm the characteristics of the power required for the set to be used, choose the external
FET.
16. Operating ranges
If it is within the operating ranges, certain circuit functions and operations are warranted in the working ambient
temperature range. With respect to characteristic values, it is unable to warrant standard values of electric
characteristics but there are no sudden variations in characteristic values within these ranges.
17. Allowable loss Pd
W
ith respect to the allowable loss, the thermal derating characteristics are shown in the Exhibit, which we hope would be
used as a good-rule-of-thumb. Should the IC be used in such a manner to exceed the allowable loss, reduction of current
capacity due to chip temperature rise, and other degraded properties inherent to the IC would result. You are strongly
urged to use the IC within the allowable loss.
18. The use in the strong electromagnetic field may sometimes cause malfunction, to which care must be taken.
19.In the event that load containing a large inductance component is connected to the output terminal, and generation of
back-EMF at the start-up and when output is turned OFF is assumed, it is requested to insert a protection diode.
20. We are certain that examples of applied circuit diagrams are recommendable,
but you are requested to thoroughly confirm the characteristics before using the IC.
In addition, when the IC is used with the external circuit changed, decide the IC
with sufficient margin provided
while consideration is being given not only to static characteristics but also
variations of external parts and our IC including transient characteristics.
OUTPUT PIN
(Example)
BD3504FVM,BD3500FVM,BD3501FVM,BD3502FVM
Technical Note
15/16
www.rohm.com
2010.05 - Rev.A
© 2010 ROHM Co., Ltd. All rights reserved.
Power Dissipation
0
100
200
300
400
500
0 25 50 75 100 125 150
Temperature Atmosphere : Ta()
Power Dissipation : Pd mW)
437.5mW
100℃
Without heat sink.
θj-a=286/W

BD3502FVM-TR

Mfr. #:
Manufacturer:
Description:
LDO Voltage Controllers LOW PWR 1.2V
Lifecycle:
New from this manufacturer.
Delivery:
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